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The Stealth Winners in iPhone X

Article by Junko Yoshida, EETimes, February 2018

You might think the world has already seen enough Apple iPhone X teardowns. But there are grunts in the trenches who just can’t seem to get enough.

Certainly, iPhone X teardowns focused on logic ICs have been there, done that. But the untrodden ground Apple has really broken is in areas such as optical modules, components, MEMS, packaging and PCB technologies, according to Romain Fraux, chief technology officer at System Plus Consulting, Yole Développement’s reverse-engineering partner.


Last week, EE Times sat down with analysts at both Yole (Lyon, France) and System Plus Consulting (Nante, France).


Asked about Apple’s most significant advancement in its iPhone X, Jean-Christophe Eloy, Yole’s CEO and president, nominated “the optical system Apple has brought to mobile devices.” He said Apple’s big milestone is that 3D sensing — an ability to recognize faces much more accurately than any existing Android phone — is now “poised to spread to everything from tablets to cars and door bells.”


EE Times asked both Eloy and Fraux to lay out highlights of their discoveries from in-depth teardowns. We also asked them to identify lesser known players who got iPhone X design wins […]



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