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ZF S-cam4 Mono tri cam - System Plus Consulting 2019

ZF S-Cam 4 – Forward Automotive Mono and Tri Camera for Advanced Driver Assistance Systems

Product code
EUR 6990
Automotive & Mobility
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Fourth generation of the S-Cam family from the leading ADAS camera player.

Currently, automotive manufacturers are integrating more options for security and are making cars safer with Advanced Driver Assistance Systems (ADAS). Automotive cameras therefore have quickly become more common in the last few years and are now an important part of the imaging market.

ZF S-cam4 tri cam module three - System Plus Consulting 2019

ZF, one of the largest tier one suppliers of automotive systems, last year released its fourth Generation S-Cam with two solutions, one with a mono camera and the other with a triple camera set-up.

These cameras feature the Omnivision CMOS image sensor, which demonstrates the shift in the procurement strategies of ZF and Intel Mobileye. In fact, the use of the latest Mobileye EyeQ4 vision processor allows new sensors to be used and makes the S-Cam4 one of the smallest and lightest products in its category.

Based on a teardown of the system, these reports detail a complete bill of material and describe the electronics and housing assembling. Moreover, a specific report describes the camera’s manufacturing and packaging processes. They present also a detailed physical analysis of the CMOS image sensor, with a cross-section of the complete camera modules.

These reports also include a comparison with the previous version in the S-Cam series, the S-Cam 3. It estimates the manufacturing cost and selling price for both the mono and tri-camera.

The teardown and the cost analysis of the System On Chip (SOC) is available in the related report “Mobileye EyeQ4 Vision Processor Family”.

ZF S-cam4 tri cam PCB cross section - System Plus Consulting 2019 ZF S-cam4 lens sem view - System Plus Consulting 2019 ZF S-cam4 Mono tri cam - System Plus Consulting 2019
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ZF Friedrichshafen AG  Company Profile

Physical Analysis

  • Views and Dimensions of the Camera
  • System Opening
  • Electronic Board

Cost Analysis

  • Accessing the BOM
    • PCB cost
    • BOM cost – electronic board
    • BOM cost – housing
    • Material cost breakdowns
  • Accessing the Added Value (AV) cost
    • Electronic board manufacturing flow
    • Details of the electronic board AV cost
    • Details of the system assembly AV cost
    • Added-value cost breakdown
  • Manufacturing Cost Breakdown

Manufacturer Price

  • Financial Ratios
  • Estimation of the Manufacturer Price

Company Services




Omnivision Company Profile

Physical Analysis

  • Mono Cam – Lens Module
  • Tri Cam – Lens Module #1
  • Tri Cam – Lens Module #2
  • Tri Cam – Lens Module #3
  • Omnivision CMOS Image Sensor
    • Packaging, sensor die and cross-section

Manufacturing Process

  • Front-End Process Flow
  • CIS Wafer Fabrication Unit
  • Die Process Flow
  • CIS Packaging Fabrication Unit
  • Packaging Process Flow

Cost Analysis

  • Yield Hypothesis
  • CIS Front-End Cost
  • Packaging Cost
  • Component Cost

Selling Price

Company Services

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