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The CGHV40100F 50V RF GaN HEMT from Wolfspeed is designed and manufactured with specific technical choices, making it a unique - System Plus Consulting

Wolfspeed RF GaN HEMT CGHV40100F

Published
11/10/2016
Product code
SP16286
Price
EUR 3 290
Applications
Industrial
Available sample Available flyer Ask for info

Wolfspeed (Infineon) offers a broad range of GaN RF products that are in high  demand throughout the energy, electronics, industrial, transportation, and military telecommunications sectors. The company’s new CGHV40100 is a unique gallium-nitride (GaN) high-electron-mobility transistor operating from a 50-volt rail and up to 3-GHz.

The CGHV40100 includes a single GaN-on-SiC HEMT die with an area of 4.17mm2. To make the source connection, the device is manufactured on ultra-thin wafer with gold vias. The HEMT shows the typical GaN epitaxy structure for lateral device and a source-connected field plate.

The device is assembled in a SOT467C package with ceramic substrate materials that possess0an excellent combination of electrical, mechanical, and thermal properties.  The flange material is CuMoCu heatsink, which has good mechanical properties but is quite expensive. Very specific and optimized choices went into the device’s design and manufacturing, resulting in a competitive, stunning product.

This report also includes complete chip and module fabrication process overviews, and an estimated cost.

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Overview/Introduction

  • Executive Summary
  • Reverse Costing Methodology

Company Profile

Physical Analysis

  • Synthesis of the Physical Analysis
  • Package
    • Package view and dimensions
    • Package opening
    • Package cross-section
  • HEMT Die
    • Die view & dimensions
    • Die marking
    • Die process
    • Die cross-section
    • Process characteristics

Manufacturing Process Flow

  • Overview
  • Wafer Fabrication Unit
  • Packaging Fabrication Unit

Cost Analysis

  • Synthesis of the Cost Analysis
  • Main Steps of Economic Analysis
  • Yields Synthesis
  • Die Cost Analysis
    • Front-end cost
    • Back-end 0: probe test & dicing cost
    • Wafer cost
    • Die cost
  • Packaging Cost Analysis
    • Packaging cost
    • Packaging step cost
  • Components Cost

Selling Price Estimation

  • Financial Results and Correction Factors
  • Manufacturer Price
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