Lighting

Toshiba TL1L4-WH0 – LED GaN on Silicon

Published: 25/06/2015
Product code: SP15224
Price: EUR 6990
Applications

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Introduction
Summary
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Toshiba has completely changed of technology to multiply by 2 the brightness of their GaN-on-silicon LEDs. Today the Toshiba white LEDs have characteristics close to the classic sapphire LED with a smaller cost.

The large panel of products and packages available today shows the maturity of Toshiba products and their willing to conquer the white LED market.

With a footprint of 3.5×3.5mm, the TL1L4-WH0 from Toshiba is tiny and benefits of the last package innovations like the sintering and a SMD leadframe with ceramic substrate.

The TL1L4 LED are produced on a cheap 8” silicon substrate in a standard power silicon facility from Toshiba. The integration in a standard facility has been facilitate by a gold-free smart bonding process.

A significant work has been done on the epitaxial layer in GaN to enhance the brightness. In 18 months, the brightness has been multiplied by 2. The optimization of the GaN epitaxy is the core of this amazing improvement.

Moreover, all the manufacturing process has been enhanced to reach this brightness. Today the Toshiba white LEDs are similar to the last sapphire LEDs with a vertical thin film with via structure.

The report includes a detailed technology and a cost analysis describing the innovations of Toshiba and a comparison with the first generation Toshiba LED.

Overview / Introduction

Toshiba Company Profile

Physical Analysis

Physical Analysis Methodology
Package
- Physical Analysis Methodology
- Package Views & Dimensions
- Package Opening
- Package X-Ray
- Package Cross-Section
- Phosphor
- Protective diode

LED
- LED Views & Dimensions
- Cathode
- Anode
- Epitaxy
- LED Thickness
- LED Characteristics

Comparison TL1L4 and TL1F1

Manufacturing Process Flow

Global Overview
LED Fabrication Unit
LED Process Flow
Package Fabrication Unit
Package Process Flow

Cost Analysis

Synthesis of the cost analysis
Main steps of economic analysis
Yields Hypotheses
Epitaxy Step
LED Epitaxy Cost
LED Front-End Cost
LED Wafer Cost
LED Cost per process step
LED Equipment Cost per Family
LED Material Cost per Family
Back-End : Probe and cleaving Cost
Packaging Cost
Packaging Cost
Final Assembly Cost
Component Cost

Price Analysis

Price definitions
Manufacturers financial ratios
Manufacturing Price with Binning