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Taiyo Yuden SAW and BAW Band 7 Duplexer integrated into Skyworks’ System in Package

Product code
EUR 3 490
Available sample Available flyer Ask for info

In the last five years, Skyworks has been the largest radio-frequency (RF) component supplier for Huawei. In Huawei’s last flagship, the Mate 9 Pro, and the P10 series, Skyworks supplies entire Long-Term Evolution (LTE) front-end solutions based on its SkyOne® Technology. The solutions comprise Low-, Mid- and High-Band front end modules (FEMs) featuring Surface Acoustic Wave (SAW) and Bulk Acoustic Wave (BAW) filters. Skyworks is known to produce its own SAW filter and to outsource the BAW filter. In its High-Band PA Module integrated Duplexer (PAMiD), Skyworks integrates a duplexer supplied by Taiyo Yuden in metal seal packaging featuring a SAW and a Thin Film Bulk Acoustic Resonator (FBAR)-BAW filter based on Taiyo Yuden Technology.

The filters are located in a System In Package (SiP) with a power amplifier, switch and a RF integrated circuit. The device is a custom version of a Taiyo Yuden commercial device. The duplexer’s SAW filter uses sapphire and lithium tantalate substrates and its BAW filter has an original FBAR design using an air gap cavity on a silicon substrate.

In this report, the complete duplexer is analyzed, from the filters to the packaging developed by Fujitsu Media Limited, which was bought by Taiyo Yuden. The report includes a complete analysis of the package, the SAW filter and the BAW filter, featuring a cost analysis and price estimation for the device. A schematic of the BAW filter is also provided to understand the difference between shunt and series cells.

Finally, the report includes complete performance and technology comparisons with the previous generation of the band 7 duplexer from Taiyo Yuden and a technology comparison with BAW filters and packaging solutions from Qorvo and Broadcom.

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Overview / Introduction

Taiyo Yuden Company Profile

Huawei Mate 9 Pro Teardown

SKY78117 Teardown

Physical Analysis

  • Physical Analysis Methodology
  • Package
    • View and dimensions
    • Package opening
    • Package cross-section
  • SAW Filter
    • View, dimensions and markings
    • IDT and reflector
    • Cross-section: substrate, pads, IDT
  • BAW Filter
    • View, dimensions and markings
    • Die overview: pads, apertures, FBAR cells, frequency control features, equivalent circuit,
    • Cross-section: substrate, pads, FBAR shunt and series cells
  • Physical Data Summary

Physical Comparison with previous duplexer generation

  • Package, Schematics, Design

Physical Comparison with Broadcom and Qorvo

  • Package, BAW Technology

Manufacturing Process Flow

  • Filter Process
  • Filter Wafer Fabrication Unit
  • SAW Filter Process Flow
  • BAW Filter Process Flow
  • Packaging Process Flow
  • Final Assembly Unit

Cost Analysis

  • Cost Analysis Overview
  • The Main Steps Used in the Economic Analysis
  • Yield Hypotheses
  • SAW and BAW Die Cost
    • SAW filter and BAW filter front-end (FE) cost
    • SAW filter and BAW filter FE per steps cost
    • Back-end: tests and dicing
    • SAW filter and BAW filter wafer and die cost
  • Component
    • Packaging cost
    • Packaging cost per process step
    • Component cost

Estimated Price Analysis

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