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MEMS IMU/Combo

STMicroelectronics LSM9DS0 9-Axis MEMS IMU

Published
12/12/2013
Product code
SP13153
Price
EUR 2 990
Applications
Consumer
Available sample Available flyer Ask for info

With a market share of more than 40%, STMicroelectronics leads the market of inertial sensors for consumer applications.

The LSM9DS0 is a 4x4mm system-in-package featuring a 3-axis gyroscope, a 3-axis accelerometer and a 3-axis magnetometer.

STMicroelectronics achieves this package footprint by integrating the 3-axis gyroscope and the 3-axis accelerometer functions on the same die. This new structure, combined with new designs for the gyroscope and the accelerometer allows ST to shrink the 6-axis function by more than 30%.

This report provides a complete teardown of the MEMS IMU with:

  • Detailed photos
  • Material analysis
  • Schematic assembly description
  • Manufacturing Process Flow
  • In-depth manufacturing cost analysis
  • Selling price estimation

 

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Introduction, STMicroelectronics Company Profile

 Physical Analysis

  • Package
  • Package Views, Dimensions & Pin Out
  • Package Opening
  • Wire Bonding Process
  • Package Cross-Section
  • ASIC Dies
  • View, Dimensions & Marking
  • Delayering
  • Main Blocks Identification
  • Cross-Section
  • MEMS Gyro/Accelero Die
  • View, Dimensions & Marking
  • Bond Pad Opening & Bond Pad
  • Cap Removed & Cap Details
  • Sensing Area Details
  • Cross-Section (Sensor, Cap & Bonding)
  • X/Y-Axis Magnetometer die
  • View, Dimensions & Marking
  • Delayering
  • Cross-Section
  • Z-Axis Magnetometer die
  • View, Dimensions & Marking
  • Delayering
  • Cross-Section

 Manufacturing Process Flow

  • ASICs Front-End & RDL Process
  • ASIC Wafer Fabrication Unit
  • MEMS Gyro/Accelero Process Flow
  • MEMS Wafer Fabrication Unit
  • Magnetometer Process Flow
  • Magnetometer Wafer Fabrication Unit
  • Packaging Process Flow
  • Package Assembly Unit

 Cost Analysis

  • Main steps of economic analysis
  • Yields Hypotheses
  • ASICs Front-End Cost
  • ASICs Back-End 0 : RDL, Probe Test & Dicing
  • ASICs Wafer & Die Cost
  • MEMS Gyro/Accelero Front-End Cost
  • MEMS Gyro/Accelero Back-End 0 : Probe Test & Dicing
  • MEMS Gyro/Accelero Wafer & Die Cost
  • Magnetometer Front-End Cost
  • Magnetometer Back-End 0 : Probe Test & Dicing
  • X/Y-Axis & Z-Axis Magnetometer Wafer & Die Cost
  • Back-End : Packaging Cost
  • Back-End : Final Test & Calibration Cost
  • LSM9DS0 Component Cost

 Estimated Price Analysis

 

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