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MEMS Pressure sensor

STMicroelectronics LPS22HB Nano Pressure Sensor, smallest MEMS barometer for smartphone and smartwatch, with a lot innovation - System Plus Consulting

STMicroelectronics LPS22HB Nano Pressure Sensor

Published
23/11/2016
Product code
SP16295
Price
EUR 3 290
Applications
Consumer
Available sample Available flyer Ask for info

The LPS22HB Nano Pressure Sensor is the world’s smallest barometric sensor, incorporating the VENSENS process and the new BASTILLE process, featuring abundant design innovation. Targeting altitude and weather forecasting applications in portable devices, this MEMS sensor positions STMicroelectronics for double-digit growth in the pressure sensor market.

STMicroelectronics LPS22HB pressure-sensing device is manufactured using a proprietary MEMS technology called “VENSENS”, which allows the pressure sensor to be fabricated on a monolithic silicon chip. The LPS22HB’s sensing element is based on a flexible silicon membrane formed above an air cavity with a controlled gap and defined internal pressure. The membrane is tiny compared to traditional silicon micro-machined membranes. The device is allowing some waterproof functionalities, detailed in the report.

For the LPS22HB, STMicroelectronics has introduced two significant innovations. The first one is a holed cap in silicon, bonded on the sensor to integrate the pressure sensor into a small molded package of 2x2x0.76mm HLGA. This package resembles the one used for the HTS221 humidity sensor. The second one is a spring structure to increase the sensor’s sensibility and reliability. These two innovations are the core of the new “Bastille” MEMS technology.

This report presents a detailed analysis of the sensor structure and cost, as well as a characteristics comparison with the 1st-generation STMicroelectronics LPS331AP pressure sensor and the Bosch Sensortec BMP280, highlighting differences in each company’s technical choices.

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Overview/Introduction

Company Profile & Supply Chain

Physical Analysis

  • Package
    • Package views and dimensions
    • Package opening
    • Package cross-section
  • ASIC Die
    • View, dimensions, and marking
    • Delayering and process
    • Cross-section
  • MEMS Die
    • View, dimensions, and marking
    • Cap removed
    • Sensing area
    • Cross-sections (sensor, cap, sealing)
  • Comparison

Manufacturing Process Flow

  • ASIC Front-End Process
  • ASIC wafer fabrication unit
  • MEMS process flow
  • MEMS wafer fabrication unit
  • Packaging process flow
  • Package assembly unit

Cost Analysis

  • Yields Hypotheses
  • ASIC Front-End Cost
  • ASIC Back-End 0: Probe Test and Dicing
  • ASIC Wafer and Die Cost
  • MEMS Front-End Cost
  • MEMS Back-End 0: Probe Test and Dicing
  • MEMS Front-End Cost per Process Steps
  • MEMS Wafer and Die Cost
  • Back-End – Packaging Cost
  • Back-End – Packaging Cost per Process Steps
  • Back-End – Final Test Cost
  • Pressure Sensor Component Cost

Estimated Price Analysis

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