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MEMS Environment

STMicroelectronics HTS221

Product code
EUR 2 990
Available sample Available flyer Ask for info

The HTS221 humidity sensor is the first environment sensor from STMicroelectronics which follows the train of new open cavity combos. Assembled in a 6-pins LGA 2 x 2 x 0.9mm package; the HTS221 is a digital humidity and temperature sensor equipped with a sensor die and an ASIC. It has operating ranges of -40…+125°C, 0…100 % relative humidity for 16bit output data for temperature and humidity.

The relative humidity sensor uses a polymer dielectric planar capacitor digital measurement technology which allows a precise response in very compact size. The integrated heater allows a high ODR.

This device uses a new type of package built around an original holed cap developed by STMicroelectronics for mobile phones and for industrial application with a temperature range from -40 °C to +120 °C.

The report presents deep technology and cost analysis of HTS221 with an exhaustive package analysis. It also includes a technology and production cost comparison with Bosch BME280 humidity and pressure sensor and with Sensirion SHTC1 humidity MEMS.

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Overview/Introduction, Companies Profile

Physical Analysis

  • Package
    • Package Views & Dimensions
    • Package Opening
    • Wire bonding Process
    • Package Cross-Section
  • ASIC Die
    • View, Dimensions & Marking
    • ASIC Delayering
    • ASIC main blocks identification
    • ASIC Process
    • ASIC Die Cross-Section
  • Pressure & Humidity Die
    • View, Dimensions & Marking
    • MEMS Humidity Sensing Area
    • Cap
    • MEMS Humidity Cross-Section
    • MEMS processes

Comparison with Bosch BME280 and Sensirion SCHTC1 pressure sensor

Manufacturing Process Flow

  • ASIC Front-End Process
  • MEMS humidity Process Flow
  • Wafer Fabrication Units
  • Packaging Process Flow & Assembly Unit

Cost Analysis

  • Main steps of economic analysis
  • Yields Hypotheses
  • ASIC Front-End Cost
  • ASIC Back-End 0 : Probe Test & Dicing
  • ASIC Front-End Cost
  • MEMS HumidityWafer & Die Cost
  • MEMS HumidityFront-End Cost
  • MEMS Humidity Back-End 0 : Probe Test & Dicing
  • Back-End : Packaging Cost
  • Back-End : Packaging Cost per Process Steps
  • Back-End : Final Test Cost
  • BME280 Component Cost

Estimated Price Analysis

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