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SORAA : Tri-LED and Lightchip. First GaN on GaN LED packaged in a silicon WLP

Product code
EUR 6990
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The first GaN on GaN LED by SORAA on the market

New in this LED: GaN substrate, triangular shape chip, simplified epitaxial structure and an original silicon-based wafer level packaging

 SORAA has recently released the first GaN on GaN LED in a 50W halogen equivalent MR16 lamp with several new features.

SORAA smartly used the GaN characteristics like the optical transparency and the high electrical and thermal conductivity to create a unique vertical structure for these LEDs. The layers deposited by epitaxy are very thin.

A high current density per sq cm is obtained, estimated at 120A / sq cm, 4x more than sapphire LED.

The SORAA LEDs have a triangular shape to limit the internal reflection of the light and thus increase the light extraction.

An original silicon package with a multilayer mirror is used to increase the light extraction of the LED lamp.

This report provides a complete teardown of the LED and the package with:

  • Detailed photos
  • Material analysis
  • Detailed structure of dies and package
  • Manufacturing Process Flow
  • In-depth economical analysis
  • Manufacturing cost breakdown
  • Selling price estimation


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1. Overview / Introduction

  • Executive Summary
  • Reverse Costing Methodology

2. Companies Profile

  • SORAA Profile

3. Lightchip Package and Tri-LED Characteristics

  • Lightchip Characteristics

4. Physical Analysis

  • Physical Analysis Methodology
  • SORAA MR16 Lamp
  • Lightchip Package Views & Dimensions
  • Lightchip Package Opening
  • Lightchip Package Cross-Section
  • Phosphor
  • Tri-LED Assembly
  • Lightchip Package Characteristics
  • Tri-LED Views & Dimensions
  • Cathode
  • Tri-LED Singulation
  • Epitaxy
  • Tri-LED Thickness

5. Manufacturing Process Flow

  • Global Overview
  • Tri-LED Fabrication Unit
  • Tri-LED Process Flow
  • Lightchip Fabrication Unit
  • Lightchip Process Flow

6. Cost Analysis

  • Synthesis of the cost analysis
  • Main steps of economic analysis
  • Yields Hypotheses
  • Tri-LED Front-End Cost
  • Tri-LED Wafer Cost
  • Tri-LED Cost per process steps
  • Tri-LED Equipment Cost per Family
  • Tri-LED Material Cost per Family
  • Back-End : Probe and cleaving Cost
  • Lightchip Packaging Cost
  • Lightchip Wafer Cost
  • Final Assembly Cost
  • Component Cost & Price




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