IMAGING

Deep analysis of the rear 3D sensing module with Sony’s CIS and Lumentum’s flood illuminator.

Following major OEMs, Huawei has joined the trend of 3D sensing technology with the integration of ToF (Time-of-Flight) technology in its flagship smartphones. For the Mate 20 pro, introduced in late 2018, the 3D sensing solution was used in facial recognition application. The P30 pro, one of the latest Huawei flagship smartphones, features a rear 3D sensing solution for depth sensing and Augmented Reality (AR) applications. This 3D sensing solution is provided by Sony Depth Sensing Solutions  which is strengthening its position as one of the leaders in this technology.

This full reverse costing study has been conducted to provide technology data, the manufacturing cost and selling price of the rear 3D sensing module found in the P30 pro.
The rear optical hub features a main red/green/blue camera, a telephoto camera, an ultrawide-angle camera and a 3D ToF module composed of separated flood illuminator and NIR camera.

This report focuses on the 3D ToF module. It includes a Back-Side Illumination (BSI) CIS featuring 10µm size pixels and resolution of 47 kilopixels developed by Sony Depth Sensing Solutions and one Vertical Cavity Surface Emitting Laser (VCSEL) for the flood illuminator coming from Lumentum.

Along with the complete physical analysis, this report analyzes costs and estimates prices for the 3D depth sensing solution. It also includes a technical and cost comparison with the rear 3D sensing solution in the Samsung Galaxy Note 10+ and the OPPO Rx17 pro. The comparison looks at the near infrared camera module and the flood illuminator architecture.

Overview/Introduction

• Executive Summary
• Reverse Costing Methodology

Company Profile

• Sony, Sunny Optical Technology and Lumentum
• Huawei P30 pro

Market Analysis

• Forecast and Supply chains

Physical Analysis

• Summary of the Physical Analysis
• 3D Sensing System Assembly
  • Module views, opening & cross-section
• NIR ToF Camera Module
  • Module view, dimensions and cross-section
• NIR ToF Image Sensor
  • Die overview and dimensions
  • Die process and cross-section
  • Die process characteristic
• Flood Illuminator
  • Module view, dimensions and cross-section
• NIR VCSEL Die
  • Die view, dimensions, process and cross-section
  • Die process characteristic

Manufacturing Process

• Overview
• NIR ToF Image Sensor Die Front-End Process and Fabrication Unit
• Flood Illuminator NIR VCSEL Process Flow and Fabrication Unit

Cost Analysis 

• Summary of the Cost Analysis
• Yield Explanations and Hypotheses
• NIR Camera Module
  • Pixel Array, BSI and optical front-end cost
  • NIR ToF image sensor wafer and die cost
  • Lens module and component cost
• Flood Illuminator
  • NIR VCSEL Front-End cost, probe test, thinning and dicing
  • NIR VCSEL die wafer cost
  • Component cost
• ToF Sensing Solution Price
• Complete Solution Price

Technical & Cost Comparison

• Huawei P30 Pro vs Galaxy Note 10+ vs OPPO Rx17 pro

• Smartphone 3D Sensing Modules Comparison 2020
• Samsung Galaxy Note 10+ 3D Time of Flight Depth Sensing Camera Module
• ams’ Direct Time-of-Flight Detection SPAD-Based Proximity Sensor
• Status of the Camera Module Industry 2019 – Focus on Wafer Level Optics
• Sony’s 3D Time-of-Flight Depth Sensing Camera Module
• Huawei Mate 20 Pro’s 3D Depth-Sensing System
• Camera Module 2017 – Physical Analyses Overview
• Camera Module Industry 2015 – Mobile CCM Technology Review
• 3D Time-of-Flight Module in Meizu 17 Pro
• Intel Realsense L515 MEMS-Based Solid-State LiDAR Camera