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Sony’s 3D ToF Depth Sensing Camera Module_2

Sony’s 3D Time-of-Flight Depth Sensing Camera Module

Published
13/03/2019
Product code
SP19403
Price
EUR 3 990
Applications
Consumer
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Deep analysis of the Sony’s 3D ToF Sensor and the VCSEL in the Oppo RX17 Pro.

Following its first introduction of a 3D structured light camera on the front of the Find X, last year, Oppo is now pioneering the use of 3D Time-of-Flight (ToF) in its Rx17 Pro. Lenovo did a similar integration on the rear of one of its products a few years ago, integrating a pmd/Infineon solution in a high-end phone. In doing this, Asus and Lenovo added an additional Near Infra-Red (NIR) Global Shutter (GS) camera, but Oppo doesn’t have such a dedicated NIR GS Camera. Instead, Oppo uses the latest generation of ToF camera technology from Sony Depthsensing Solutions, formerly known as SoftKinetic.

 Sony’s 3D ToF Depth Sensing Camera Module_2

The rear optical hub is packaged in one metal enclosure and features several cameras and a flood illuminator. The complete system features a telephoto and  wide-angle camera module and a 3D ToF camera. The distinguishing characteristic of the 3D depth sensing camera is the addition of a NIR flood illuminator.

This report focuses its analysis on the 3D depth sensing system. All components are standard and can be found on the market. That includes a BackSide Illumination (BSI) ToF image sensor featuring 10 µm x 10 µm size pixels and resolution of 46 kilopixel, developed by Sony Depthsensing Solutions. It also has one vertical cavity surface emitting laser (VCSEL) for the flood illuminator, coming from a major supplier. This is the first ToF imager found on the market featuring BSI technology, which is commonly used by Sony, coupled with Current Assisted Photonic Demo-dulation (CPAD) developed by Sony Depthsensing Solutions.

Along with the complete 3D depth sensing system, this report analyses the system’s cost and estimates its price. It also includes a physical and technical comparison with another 3D sensing system from Lenovo in the Phab2Pro, using the first generation pmd/Infineon ToF Imager. The comparison looks at system integration, the NIR camera module and the flood illuminator architecture.

SP19403-Sony’s 3D ToF Depth Sensing Camera Module_1 SP19403-Sony’s 3D ToF Depth Sensing Camera Module_3SP19403-Sony’s 3D ToF Depth Sensing Camera Module_4
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Overview/Introduction

Sony Company Profile

Oppo RX17 Pro – Teardown and Market Analysis

Physical Analysis

  • Physical Analysis Methodology
  • 3D Sensing System Disassembly and Cross-Section
  • NIR Camera ToF Sensor
    • View, dimensions, and cross-section
  • NIR Camera ToF Sensor Die
    • View, dimensions, pixels, delayering and main block IDs
    • Process and cross-section
  • Flood Illuminator Module Disassembly and Cross-Section
  • NIR VCSEL Dies
    • View, and dimensions
    • Dies process and cross-section
  • Physical Data Summary

Physical Comparison: Lenovo Phab2Pro

  • System Integration
  • NIR Camera Module and ToF Sensor
  • Flood Illuminator and VCSEL

Manufacturing Process

  • Die Fabrication Unit : NIR Image Sensor, NIR VCSEL,
  • NIR Image Sensor and VCSEL Process Flow

Cost Analysis

  • Cost Analysis Overview
  • Supply Chain Description and Yield Hypotheses
  • NIR Image Camera Module Cost
    • Front-end (FE), microlens, BSI and total FE cost
    • Wafer and die cost
    • Lens module and assembly cost
  • NIR Flood Illuminator Cost
    • Front-End (FE) cost
    • FE cost per process step
    • Wafer and die cost
    • Assembly cost

Estimated Price Analysis: NIR Camera Module, Flood Illuminator Module, and Optical Hub

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