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SP20470-Camera Module Overview breakdown

Smartphone Camera Module Comparison 2020 Vol. 1

Published
01/04/2020
Product code
SP20470
Price
EUR 6 490
Applications
Consumer
Available sample Available flyer Ask for info

Overview of the latest flagship smartphone cameras released in 2019 with detailed technical and cost analyses of the Huawei P30 Pro, Samsung Galaxy S10 5G/S10+ and Apple iPhone 11 Pro.

SP20470-Camera Module Opening

The best way to understand the camera module market and its technology trends is a complete and detailed study of all released products. We have chosen the latest flagship smartphones in this volume, from Samsung, Huawei and Apple, to show Camera Module choices for these three manufacturers.

The analyses cover the cameras integrated in the Samsung Galaxy S10 5G – Korea Version and S10+, the Huawei P30 Pro and finally the Apple iPhone 11 Pro. They show the complete structure, the design and the cost of the front and rear facing camera modules, from the technology node of the CMOS Image Sensor (CIS) to the camera lens.

This report is also an updated combined report of the previous “Mobile Camera Module Comparison 2019” and “Mobile CMOS Image Sensor Comparison 2019”. Notable developments include the periscope camera in the Huawei P30 Pro and the transition to three cameras on the back for Samsung and Apple.

This report also includes an overview of cameras released in H2 of 2019 from different manufacturers. It allows monitoring of technological develop-ments, manufacturers’ choices for CIS and Camera Module structures, the supply chain and manufacturing costs for flagship smartphones.

This report offers an overview of how different manufacturers’ technical choices have evolved. For example, the total silicon area per smartphone is 130mm² for the latest Huawei model, compared with 144mm² for Samsung’s S10 5G Korea Version. It also includes camera module and CIS die costs.

In conclusion, we perform a detailed teardown to identify the CMOS manufacturing technology and its 3D integration format, such as hybrid bonding or through-silicon-via (TSV) connections.

SP20470-Camera Module Overview breakdownSP20470-Camera Module Cross-SectionSP20470-CMOS Image Sensor Cross-Section

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Overview/Introduction

  • Executive Summary
  • Reverse Costing Methodology
  • Glossary
  • Smartphone List Released in 2019

Physical Comparison

  • Camera Module Overview
  • Summary of the Physical Analysis
    • Camera Module Overview per Smartphone
    • CMOS Image Sensor Overview per Smartphone
    • Summary Table

Cost Comparison

  • General Module Structure
  • Process Description
    • Sony
    • Samsung
    • Summary and Process Comparison
  • CIS Die Cost Comparison
    • Front-Facing
    • Rear-Facing
  • CM Cost Comparison
    • Front-Facing
    • Rear-Facing

Detailed Physical Analysis

  • Samsung Galaxy S10 (SM-G977N)
    • Front Camera
    • Rear Tri Camera
  • Samsung Galaxy S10+ (SM-G975F)
    • Dual Front Camera
    • Rear Tri Camera
  • Huawei P30 Pro (VOG-L29)
    • Front Camera
    • Rear Tri Camera
  • Apple iPhone 11 Pro
    • Front Camera
    • Rear Tri Camera
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