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MEMS Oscillator

SiTime SiT8002 – MEMS Oscillator

Published
25/12/2009
Product code
SP10024
Price
EUR 1 990
Applications
Available sample Available flyer Ask for info

System Plus Consulting is proud to publish the reverse costing report of the MEMS Oscillator SiT8002 supplied by SiTime Corporation.

The SiTime SiT8002 is a one-time programmable 1MHz to 125MHz oscillator. Completely quartz-free, It uses a standard 2.5×2.0mm 4-land MLF-type package containing 2 stacked dies: a MEMS resonator and an ASIC for signal conditioning. The MEMS resonator is manufactured on SOI wafers using MEMS FirstTM process licensed by Robert Bosch GmbH. The SiT8002 programmable oscillator is suitable for use in clock generation for consumer, portable, industrial, automotive, and computation applications.

This report provides complete teardown of the MEMS Oscillator with:

  • Detailed photos
  • Material analysis
  • Schematic assembly description
  • Manufacturing Process Flow
  • In-depth economical analysis
  • Manufacturing cost breakdown
  • Selling price estimation
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Glossary

Overview/Introduction

  • Executive Summary
  • Reverse Costing Methodology

SiTime Company Profile

  • Product Range
  • Business Model

Physical analysis

  • Synthesis of the Physical Analysis
  • Physical Analysis Methodology
  • Package Characteristics & Markings
  • Package X-Ray
  • Package Opening & Bonding Number
  • ASIC Markings
  • ASIC Dimensions
  • ASIC Minimal Dimension and Metal Layers
  • ASIC Process Characteristics
  • Resonator Markings
  • Resonator Dimensions
  • Resonator with Cap and Electrical Contacts
  • Resonator after Cap Polishing
  • Resonator Electrical Contact Details
  • Resonator Cross-Section
  • MEMS process characteristics

Manufacturing Process Flow

  • Overview
  • ASIC Process Flow
  • MEMS Process Flow
  • Description of the Wafer Fabrication Units

Cost Analysis

  • Synthesis of the Cost Analysis
  • Main Steps of Economic Analysis
  • Supply Chain Analysis
  • Manufacturers Financial ratios
  • Yields Explanation
  • ASIC Front-End Cost – Hypothesis
  • ASIC Front-End Cost
  • ASIC Back-End 0 : Probe Test
  • ASIC Back-End 0 : Backgrinding and Dicing
  • ASIC Wafer Cost
  • ASIC Die Cost
  • MEMS Front-End Cost – Hypothesis
  • MEMS Front-End Cost
  • MEMS Front-End Cost per Process Steps
  • MEMS Front-End : Equipment Cost per Family
  • MEMS Front-End : Material Cost per Family
  • MEMS Back-End 0 : Probe Test
  • MEMS Back-End 0 : Backgrinding and Dicing
  • MEMS Wafer Cost
  • MEMS Die cost
  • SiT8002 Packaging Cost Hypothesis & Process Flow
  • SiT8002 Packaging Cost
  • SiT8002 Final Test Cost
  • SiT8002 Component Manufacturing Cost
  • Yield Synthesis
  • SiT8002 Cost Analysis Evolution

Estimated Manufacturer Price Analysis

 Conclusion

 

 

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