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Silicon Sensing Systems Gyroscope Design Comparison - SPR21632 - Silicon Sensing Gyroscope solution - System Plus Consulting

Silicon Sensing Systems Gyroscope Design Comparison

Published
29/07/2021
Product code
SPR21632
Price
EUR 6,490
Applications
Automotive Industrial
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Technical and cost comparison of the technologies integrated by Silicon Sensing in its piezoelectric, capacitive and inductive gyroscopes.

Silicon Sensing Systems Gyroscope Design Comparison - SPR21632 - Silicon Sensing Gyroscope solution - System Plus Consulting
Founded in 1998, Silicon Sensing is now a world leader in high-end Inertial Measurement Unit (IMU) technology. During the last six years, Silicon Sensing, which is a joint venture between Sumitomo Precision Products and UTC Aerospace Systems, has upgraded its portfolio and added two new technologies to implement its gyroscope MEMS. This report highlights the inductive, capacitive and piezoelectric Vibration Structure Gyroscope (VSG) technologies from Silicon Sensing.
The report studies three components. The CMS300 is dedicated to automotive applications. The CRG20 is for automotive and industrial applications. The SGH03 is found in the CHR02 module, a tactical grade gyroscope. These represent the three main Silicon Sensing technologies and markets.
Silicon Sensing has a broad range of products from simple axis gyroscopes and accelerometers up to IMU modules. Its market applications are mainly high-end with aeronautic, military, marine but also the IMU for the high-growth Advanced Driver Assistance System (ADAS) automotive market. All the products integrate a VSG but the drive technology is very different between them.
Silicon Sensing has developed three different technologies to create the vibration in the oscillating ring. Today, they are optimized for different markets and applications.
This report studies metallic and ceramic package technologies, with and without vacuum seal and integrated circuit (IC) die. Every gyro is calibrated for different application grades, like automotive or aeronautic. The gyroscopes are laser trimmed after manufacturing to enhance their accuracy.

This full reverse costing study has been conducted to provide insights into technology data, the manufacturing cost and selling price of three Silicon Sensor technology platforms. The specific platforms are the VSG3Qmax, latest iteration of the inductive drive VSG, the capacitive drive VSG and the latest technology the piezoelectric drive VSG.
The report contains a detailed comparative physical analysis with process descriptions and a comparative manufacturing cost analysis between the three gyroscopes. A teardown, a bill of material, cost and selling price estimation of each IMU selected is also available.

Silicon Sensing Systems Gyroscope Design Comparison - CRG20 – ICs - System Plus Consulting Silicon Sensing Systems Gyroscope Design ComparisonCMS300 – VSG5 Piezoelectric Gyro - System Plus Consulting Silicon Sensing Systems Gyroscope Design Comparison - SGH02 – VSG3Qmax Inductive Gyro - System Plus Consulting
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Overview/Introduction

  • Executive Summary
  • Reverse Costing Methodology

Company Profile              

Physical Analysis     

  • Summary of the Physical Analysis
  • CMS300 – piezoelectric Gyroscope
    • Package Views
    • Die Overview and Dimensions
    • Die Process
    • Die Cross-Section
    • Die Process Characteristics
  • CRG20-01 – Capacitive Gyroscope
    • Package Views
    • Package Cross-Section
    • Die Overview and Dimensions
    • Die Process
    • Die Cross-Section
    • Die Process Characteristics
  • SGH03-13L03 – Inductive Gyroscope
    • Package Views
    • Package Cross-Section
    • Die Overview and Dimensions
    • Die Process
    • Die Cross-Section

Die Process Characteristics Manufacturing Process    

  • CMS300 – piezoelectric Gyroscope
    • Global Overview
    • ROIC Wafer
    • Microbolometer Wafer
    • Process Flow
  • CRG20-01 – Capacitive Gyroscope
  • SGH03-13L03 – Inductive Gyroscope

Cost Analysis     

  • Yield Explanations and Hypotheses
  • CMS300 – Piezoelectric Gyroscope
    • Gyroscope MEMS Wafer and Die Cost
    • BOM Cost
    • Package Cost
    • Component Cost
  • CRG20-01 – Capacitive Gyroscope

SGH03-13L03 – Inductive Gyroscope   

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