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Power Electronics

SPR21540-Die Topsides – Optical View

Silicon IGBT Comparison 2021

Product code
EUR 6990
Automotive & Mobility Industrial
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Exhaustive technology and cost comparisons of 31 Silicon IGBTs from Infineon, ON Semiconductor, STMicroelectronics, Mitsubishi, Rohm, Toshiba, Fuji Electric, Littelfuse, ABB, Microsemi, and the IGBT in StarPower’s module.

SPR21540-Discrete Package Opening – Optical View

Silicon (Si) devices represent the majority of the power electronics market. In 2019, the power semiconductor device market segment was worth US$17.5 billion, with a Compound Annual Growth Rate (CAGR) for 2019-2025 of 4.3% according to Yole Développement.

Silicon devices such as IGBTs are benefiting from mature infrastructure and processes. New device generations are coming to the market. In addition to performance improvements, Si IGBT costs will further be reduced thanks to a 12-inch Si wafer transition that will make the competition with WBG materials even tougher.

Si IGBT players offer different approaches for device design, depending on the targeted electrical performance and applications. Most of them have adopted the Field-Stop (FS) trench structure.

In this report, System Plus Consulting presents an overview of the state of the art of 31 Si IGBT transistors of eight voltage classes from 11 main IGBT market players. The report highlights differences in device design and manufacturing processes, and their impact on device size and production cost.

Detailed physical analysis is performed for 17 IGBTs. For devices previously analyzed by System Plus Consulting, please refer to the corresponding reports for the full technology analysis. Cost simulations are detailed for all 31 IGBTs. It includes their estimated manufacturing cost with breakdowns, and their selling price.

Finally, this report provides exhaustive physical, technological and manufacturing cost comparisons of the analyzed Si IGBTs, and a current density and die Ampere cost comparisons with SiC Transistors.

SPR21540-Die Topsides – Optical View SPR21540-Die Delayering – Optical View SPR21540-Die Cross-Section – SEM View
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Overview / Introduction

  • Executive Summary, Reverse Costing Methodology, and Glossary

Technology and Market

Company Profile

  • Infineon, ON Semiconductor, STMicroelectronics, Mitsubishi, Rohm, Toshiba, Fuji Electric, Littelfuse, ABB, Microsemi, StarPower

Physical Analysis

  • 650V IGBTs
    • Infineon, ON Semiconductor, STMicroelectronics, Mitsubishi, Rohm
  • 750V IGBT
    • StarPower
  • 900V IGBT
    • Microsemi
  • 1200V IGBT
    • Infineon, ON Semiconductor, STMicroelectronics, Mitsubishi, Toshiba, Fuji Electric, Littlefuse
  • 1700V IGBT
    • Littelfuse, ABB
  • 2500V IGBT
    • Littelfuse
  • 3000V IGBT
    • Littelfuse
  • 3600V IGBT
    • Littelfuse

Technology and Physical Comparison

  • Device Performance Comparisons: FOM, Current Density
  • Device Design Comparisons
  • Physical Parameters Trends

Manufacturing Process Flow

  • Supply Chain of All Analyzed Manufacturers
  • Wafer Fabrication Unit Hypotheses for all Analyzed Manufacturers
  • Manufacturing Process Flow Schematics of Selected IGBT Processes

Cost Analysis

  • Yield Explanations and Hypotheses
  • For Each of the 31 IGBTs:
    • Wafer cost
    • Die cost
    • Packaging cost, only for discrete packaging
    • Component cost
    • Component price

Cost Comparison

  • Comparisons Include Wafer, Die Costs, Die Ampere Costs for Each Voltage Class
  • SiC Transistor vs Si IGBT Die Ampere Cost Comparison
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