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Lighting

Sharp – Mini Zenigata

Published
21/04/2011
Product code
SP11058
Price
EUR 6990
Applications
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System Plus Consulting is proud to publish the reverse costing report of the GW5BTF27K00 Warm White LED supplied by Sharp. Based on a complete teardown process, the report provides an estimation of the production cost as well as the selling price of the component.

The GW5BTF27K00 has a maximum brightness of 355lm at 700mA with a consumption of 6.7W.

The module is provided in a specific 2-pins package integrating multiple LED chips using COB.

It can be used in a wide range of lighting applications, including commercial/residential directional lighting, general indoor/outdoor illumination, LED retrofit bulbs, spotlight, road lighting…

This report provides complete teardown of the LED with:

  • Detailed photos
  • Material analysis
  • Schematic assembly description
  • Manufacturing Process Flow
  • In-depth economical analysis
  • Manufacturing cost breakdown
  • Selling price estimation

 

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Glossary

 1. Overview / Introduction

  • Executive Summary
  • Comparison of the Analyzed LEDs
  • Reverse Costing Methodology
  • GW5BTF27K00

 2. Physical Analysis

  • About the Physical Analysis
  • Physical Analysis Methodology
  • Package Characteristics
  • Package X-Ray
  • Package Connection
  • Dam and Fill
  • Phosphor
  • LEDs in the package
  • Package synthesis
  • Semiconductor Die
  • Patterned Sapphire Substrate
  • Epitaxial Structure
  • Structure
  • Passivation
  • Cathode
  • Anode
  • Active Layers – GaN die
  • Blue LED Structure

 3. Manufacturing Process Flow

  • LED Die Process Flow
  • Description of the Wafer Fabrication Units

4. Cost Analysis

  • Synthesis of the Cost Analysis
  • Yields Explanation
  • Yield Hypotheses
  • LED Front-End Cost
  • Front-End : Epitaxy Hypotheses
  • Front-End : Epitaxy Cost
  • Front-End : Epitaxy Cost per Steps
  • Front-End : Other Front-End Cost
  • Front-End : Other Front-End Cost per Steps
  • Front-End Cost per Equipment Family
  • Front-End Cost per Consumable Family
  • Dies per Wafer & Probe Test
  • Back-End 0 : Probe Cost
  • Back-End 0 : Dicing Cost
  • LED Wafer & Die Cost (FE + BE 0)
  • Back-End 1 : Packaging Hypothesis
  • Back-End 1 : Packaging Process Flow
  • Back-End 1 : Packaging Cost Details
  • Back-End 1 : Final Test Cost
  • Component Manufacturing Cost (FE+BE0+BE1)
  • Cost Analysis Evolution

 5. Estimated Manufacturer Price Analysis

  • Price definitions
  • Manufacturers financial ratios
  • Binning Impact on Manufacturing Price
  • Ideal manufacturer Price
  • Manufacturing Price with Binning Yield

 Conclusion

 

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