Sensing

Competitively priced miniature carbon dioxide, relative humidity and temperature sensor combo.

Smart heating, ventilation and air conditioning (HVAC) seeks to reduce air extraction and limit energy consumption. But good extraction is important to limit humidity and CO2 concentration and ensure well-being. With a CO2 gas, humidity and temperature sensor, the SCD30 module gives all the environmental data for HVAC, making it smarter.

Today only a few companies share this market. Sensirion, a leading manufacturer of digital microsensors and systems, recently released a CO2 gas sensor designed for HVAC applications, the SCD30, a Non-Diffractive Infra-Red (NDIR) sensor. With a small package volume under 5.6cm3, this CO2 gas sensor can be integrated into HVAC installations.

Sensirion has developed a thermopile die based on its air flow sensor technology called CMOSens. This technology allows integration of CMOS digital and analog functions with a very thin membrane manufactured in the metal layer. The technology of the CO2 gas sensor is not only in the silicon. The package and the IR filters are very important for the accuracy of the measurement.

The module embedded the SHT31 humidity sensor of Sensirion and an ultra-low power microcontroller from STMicroelectronics control the module and communications.

This report includes a technology and cost analysis of the SCD30 combo. All the main parts of the sensor are studied, including the humidity sensor, the other module parts and the assembly. Pictures and cross-sections for the electronic components and for the module are shown. These analyses provide the technical intelligence necessary to understand this technology.

Overview/Introduction

• Executive Summary
• Reverse Costing Methodology

Company Profile: Sensirion

Physical Analysis

• Physical Analysis Methodology
• SCD30 CO2 Gas Sensor Scanner Disassembly
  • Optical CO2 gas sensor disassembly
  • Plastic parts and IR filters
  • PCB and BOM
• Thermopile Sensor Die
  • View, dimensions and marking
  • MEMS opening and cross-section
  • Process characteristics
• STMicro Microcontroller
• SHT31 RHT/T Sensor

Manufacturing Process Flow

• Overview
• Thermopile Sensor Die Front-End Process and Fabrication Unit
• PCB and System Assembly Process
• Final Test and Assembly Unit

Cost Analysis

• Yield Explanations and Hypotheses
• SHT31 RH/T Sensor
• Sensirion Thermopile Die
  • Front-end cost
  • Wafer and die cost
• IR Filters
• SCD30 Module
  • BOM cost
  • Added value cost
  • SCD30 CO2 gas sensor cost

Estimated Price Analysis

• Manufacturer Financial Ratios
• Estimated Manufacturer Prices

• Particle Sensor Comparison 2019
• MEMS Pressure Sensor Comparison 2018
• Spectral Engines Nirone Sensor X
• USound Achelous UT-P 2016 MEMS Speaker
• HP746 HDNA Inkjet Die from HP
• Miniaturized Gas Sensor Comparison 2018
• Epson PrecisionCore Printhead with MicroTFP Inkjet Dies
• Hamamatsu C12880MA Micro-spectrometer
• SGP30 Gas Sensor from Sensirion
• NanoLambda NSP32-V1 Nano Spectrometer