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Samsung Galaxy S9+ Teardown and Identification of key devices, advanced packaging technical choices and main suppliers - System Plus Consulting

Samsung Galaxy S9+ Teardown and Identification of Key Components

Published: 28/03/2018
Product code: SP18402
Price: EUR 1 490
Applications: Consumer

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Introduction
Summary
Similar reports

Discover Samsung’s key devices, advanced packaging technical choices and main suppliers.

Tearing down the Samsung Galaxy S9+, this report focuses in on more than 40 integrated circuits (ICs) from the main boards.

It will help you to identify the manufacturers, the packaging size, type and pitch as well as the function of the main ICs of the S9+. A physical analysis of the main substrates highlights internal structures and technologies used for the printed circuit boards (PCBs).

The report includes teardown photos, detailed package identifications and descriptions, and is accompanied by an Excel file summarizing the S9+ chipset and breaking down the devices by supplier, packages or footprint.

Overview/Introduction

Executive Summary

Physical Analysis

Views and dimensions of the S9+
S9+ teardown
Electronic boards high definition photos
Main component markings, packaging type, dimensions, pitch, pin count and identification
PCB surface, cross section and minimum line width
IC package breakdown
IC manufacturer design wins
IC package footprint