IMAGING Infrared

Deep analysis of the rear 3D sensing module with Sony’s 2nd Generation CIS.

In order to support its recently registered trademark ‘Make & Play 3D’, Samsung is equipping its smartphones with 3D sensing modules. The Galaxy Note 10+ has one in the back side. Samsung is using the latest generation of Sony Depth sensing Solutions’ Time-of-Flight (ToF) camera, which is unveiled in this report.

The rear optical hub is packaged in one metal enclosure and features several cameras and a flood illuminator. The complete system features a main red/green/blue camera, a Telephoto, a Wide-angle Camera Module and a 3D Time of Flight Camera. The 3D Depth sensing module has a unique compact packaged near infrared (NIR) flood illuminator with the Vertical Cavity Surface Emitting Laser (VCSEL) driver placed on bottom using a flex printed circuit board (PCB).

This report is focused on the analysis of the 3D depth sensing module. It includes a backside illumination (BSI) Time of Flight Image Sensor array featuring 5µm size pixels and 323 kilopixel VGA resolution developed by Sony Depth sensing Solutions. It has one VCSEL for the flood illuminator coming from a major supplier.

Along with the complete 3D depth sensing system teardown, this report includes a cost analysis and price estimation for the module. It also includes a physical and technical comparison with another 3D sensing system from Oppo Rx17 pro as well as the 3D sensing solution for the Samsung Galaxy S10. The comparison looks at module integration, the NIR ToF camera module and the Flood Illuminator architecture.

Overview/Introduction

• Executive Summary
• Reverse Costing Methodology

Company Profile

• Sony, SEMCO and Trumpf
• Samsung Galaxy Note10+ Teardown

Market Analysis

• Ecosystem and Forecast

Physical Analysis

• Summary of the Physical Analysis
• 3D Sensing System Assembly
  • Module views and opening
  • System cross-section
• NIR Camera Module
  • Module view, dimensions and cross-section
• NIR ToF Image Sensor
  • Die overview and dimensions
  • Die process and cross-section
• Flood Illuminator
  • Module view and dimensions and cross-section
• NIR VCSEL Die
  • Die view and dimensions
  • Die process and cross-section

Manufacturing Process

• NIR ToF Image Sensor Die Front-End Process and Fabrication Unit
• Flood Illuminator NIR VCSEL Process Flow and Fabrication Unit
• Summary of the Main Parts

Cost Analysis 

• Summary of the Cost Analysis
• Yield Explanations and Hypotheses
• NIR Camera Module
  • Pixel Array, BSI and optical front-end cost
  • NIR ToF image sensor wafer and die cost
• Flood Illuminator Module
  • NIR VCSEL FE cost and probe test, thinning and dicing
  • NIR VCSEL die wafer cost
  • Component cost
• 3D ToF Module
  • Lens module and component cost
  • Complete system price

Technical & Cost Comparison

• Galaxy S10 vs. Galaxy Note 10+ 3D sensing
• Oppo Rx17 Pro vs. Galaxy Note 10+ 3D sensing

• Sony’s 3D Time-of-Flight Sensing Solution in the Huawei P30 pro
• Status of the Camera Module Industry 2019 – Focus on Wafer Level Optics
• Sony’s 3D Time-of-Flight Depth Sensing Camera Module
• Apple vs. Samsung: Ambient Light and Proximity Sensing Devices Comparison
• Camera Module 2017 – Physical Analyses Overview
• Samsung Galaxy S8 Iris Scanner
• Camera Module Industry 2015 – Mobile CCM Technology Review
• pmd/Infineon’s 3D Indirect Time-of-Flight in LG G8 ThinQ
• Melexis Far Infrared Thermal Sensor MLX90640
• Panasonic’s 3D Time-of-Flight Depth Sensing Camera Module