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Samsung Exynos 2100 System-on-Chip - Package-on-Package Cross-Section - System Plus Consulting

Samsung Exynos 2100 System-on-Chip

Product code
EUR 6990
Mobile & Consumer
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5G mobile processor using Samsung’s 5nm FinFET process with embedded packaging.

Samsung Exynos 2100 System-on-Chip - Package-on-Package Cross-Section - System Plus Consulting

System-on-chip (SoC) circuits using 5nm were introduced in late 2020/early 2021, and Samsung now addresses a growing mobile processor market that complements 5G connectivity.  Samsung’s Exynos 2100 5G mobile processor is a high-end SoC using Samsung’s smallest technology. This SoC die competes with the Qualcomm Snapdragon 888 and Apple A14 processor.

The processor die design uses an 8-core chipset. It has one core Cortex-X1 at 2900 MHz, three core Cortex-A78 at 2800 MHz, and four core Cortex-A55 at 2200 MHz. The SoC is built on a 5nm EUV process designed to boost the power efficiency of mobile devicesThe chip is specifically designed to cater to 5G high performance and hyper-fast processing speed. The Exynos 2100 SoC also integrates an advanced multi-IP governor technology used to optimize power usages. The chip manufacturer claims that mobile phones powered by the Exynos 2100 have increased battery life compared to mobile devices powered by Samsung’s previous-generation processors. Samsung DRAM memory comes in different capacity on different smartphone versions.
This full teardown includes a package analysis and a separation of the processor package and the DRAM memory, and details the processor die and capacitor layout in the package. 3D x-ray images detail the package and substrate structure, and a package analysis reveals a package-on-package component that includes the memory package soldered on the processor package. The processor die is assembled in flip-chip and embedded in the package substrate. A floorplan analysis discloses the high-level chip architecture and an estimation of IP block area, while high-resolution SEM and TEM images expose Samsung’s 5nm process technology. This report also provides a materials analysis that details the materials used to build the processor component, and cross-section analyses are included that examines the manufacturing process of Samsung’s processor. A cost analysis is also included, offering an estimation of the wafer cost, die cost, and component cost of the Exynos 2100 processor.

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  • Executive Summary
  • Reverse Costing Methodology

Company Profile & Market Analysis

  • Samsung Financial
  • Samsung Fabrication Unit
  • Processor Applications and Performance
  • Exynos 2100 vs. Exynos 990

Physical Analysis

  • Samsung Financial
  • Summary of the Physical Analysis
  • Package Analysis
  • Package Views
    • Package Cross-Section
    • Processor Cross-Section
    • Memory Cross-Section
    • Package-on-Package Separation
  • Processor Die
    • Processor Die View & Dimensions
    • Processor Delayering
    • Processor Die Process
    • Processor Die Cross-Section
    • Processor Die Process Characteristics
  • FEOL TEM Analysis
  • Floorplan
  • Memory
    • Package Overview

Manufacturing Process

  • Processor Die Front-End Process
  • Processor Fabrication Unit
  • Final Test & Packaging Fabrication Unit
  • Summary of the Main Parts

Cost Analysis

  • Summary of the Cost Analysis
  • Yields Explanation & Hypotheses
  • Processor Die
    • Die Front-End Cost
    • Die Probe Test, Thinning & Dicing
    • Die Wafer Cost
    • Die Cost
    • Packaging Cost
    • Component Cost

Estimated Selling Price

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