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IC & RF Memory

SP19489- 3D V-NAND 92 Layer Samsung_1

Samsung 3D V-NAND 92-Layer Memory

Published
17/09/2019
Product code
SP19489
Price
EUR 3 990
Applications
Consumer
Available sample Available flyer Ask for info

Fifth generation 3D NAND memory chip reveals Samsung’s latest memory technology and fabrication methods.

SP19489- 3D V-NAND 92 Layer Samsung_2

The new technology era has a huge impact on Non-Volatile Memory (NVM), demanding memories with faster speed and higher storage capacity. Manufacturers have therefore channeled investment into the development of new NVMs with more memory cells in a single chip.

Samsung continues to dominate the semiconductor industry, including the memory industry, as shown by the magnificent $22 billion revenue in 2018 generated by its NAND memory business. Its manufacturing techniques change from one generation to another to produce reliable memory chips with higher capacity.

This report presents a detailed technology study of the latest Samsung 3D Vertical-NAND memory made with 92-Layer word lines. Thanks to high quality optical images and high-resolution scanning electron microscope (SEM) images, the physical analysis shows details of die cross sections, including material identification. The report includes a detailed process to better understand the major fabrication steps. It also includes a cost estimation of producing Samsung’s new generation 3D NAND chips and the packaging cost.

Finally, this report features a comparison of Samsung’s previous NVM generation with the latest generation. This identifies the different and similar features in the two generations, and compares the fabrication cost and the impact of the added layers.

 

SP19489- 3D V-NAND 92 Layer Samsung_1SP19489- 3D V-NAND 92 Layer Samsung_3SP19489- 3D V-NAND 92 Layer Samsung_4

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Overview/Introduction 

  • Executive Summary
  • Reverse Costing Methodology

Samsung Company Profile    

Market Analysis       

  • NAND Flash Market Revenue
  • NAND Market Shipments
  • Samsung NAND Flash RoadMap

Physical Analysis      

  • Summary of the Physical Analysis
  • Physical Analysis Methodology
  • 970 EVO Plus SSD Teardown
  • Package View and Dimensions
  • Memory Die
    • View, dimensions and markings
    • Cross-section
    • Contacts and metallization
  • 3D NAND Patents

Manufacturing Process Flow   

  • Overview
  • Fab Unit
  • Process Flow

Cost Analysis  

  • Summary of the Cost Analysis
  • Yields Explanation and Hypotheses
  • Memory 3D 92-Layer
    • Memory front-end cost
    • Memory front-end cost per process steps
  • Process Steps
  • Component
    • Bonding front-end cost
    • Memory wafer and die cost
    • Back-end: Final test cost
    • Memory 3D 92-layer component cost

Selling Price

Comparison between Samsung 92-Layer and 64-Layer V-NAND

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