IC & RF RF IC

With integrated passive devices (IPD) accounting for almost 70 % of the PCB area in smartphones, integration is a challenge that several integrated device manufacturers (IDM) and outsourced semiconductor assembly & test (OSAT) companies have accepted in the last few years. Players active in the RF applications market include IDM companies like Qorvo, Skyworks, Murata, Broadcom, and STMicroelectronics, as well as OSATs such as STATS ChipPAC, ASE, Amkor, and TSMC. With 5G communication technology incoming, this is the perfect time to explore several IPD technologies and compare the different companies’ integration choices and cost efficiencies.

This report provides a deep analysis of RF IPD containing inductance, resistor, and capacitance. Its complete System Plus reports portfolio along with decoupling capacitors IPD.

This comparative technology study was conducted to provide insight regarding technology and cost estimates for RF IPDs in various applications. This report studies nine devices in three applications (Wifi/Bluetooth/cellular communication (LTE/HSPA/GPRS/EDGE), industrial, and scientific/medical short-range devices (ISM/SRD), where five players (Qorvo, Skyworks, Murata, Broadcom, and STMicroelectronics) are active. Besides the ISM/SRD applications, the other devices are extracted from recent smartphones like the new Apple iPhone X.

All devices are analyzed in detail, and electrical structures of each component are presented. Sizes and technologies are extracted to provide a large sampling of various IDMs’ technical and economical choices. We also provide an overview of passive integration techniques for inductors, resistors, and capacitors.

This report includes a description of each component, its major characteristics (substrate type (GaAs, silicon, glass), passivation layers, passive integration, etc.) and a comparison of all devices analyzed. Also included is a manufacturing cost estimate for the IPDs.

    

Overview / Introduction

Company Profile (Skyworks Solutions, Murata, iPDIA, Qorvo, Broadcom, STMicroelectronics)

Smartphone Teardown (Xiaomi Mi6, Samsung Galaxy S8, Samsung Galaxy S7, Apple iPhone X)

Market Analysis

Physical Analysis

• RF IPD for Wifi/Bluetooth Applications
  • Qorvo, STMicroelectronics, and Skyworks IPD
    • Die view and dimensions
    • Die structure: Inductance, capacitance, resistance, electrical schematic
    • Die cross-section: Metal layers, capacitance, resistance, passivation

• RF IPD for LTE/HSPA/EDGE/GSM Applications
  • Murata, Broadcom, and Skyworks IPD
    • Die view and dimensions
    • Die structure: Inductance, capacitance, resistance, electrical schematic
    • Die cross-section: Metal layers, capacitance, resistance, passivation

• RF IPD for ISM/SRD Applications
  • iPDIA and STMicroelectronics’ IPD
    • Die view and dimensions
    • Die structure: Inductance, capacitance, resistance, electrical schematic
    • Die cross-section: Metal layers, capacitance, resistance, passivation
    • IPD technologies comparison

Manufacturing Process Flow

• RF IPD die fabrication unit
• RF IPD package process flow

Cost Analysis

• Cost analysis overview
• Supply chain description
• Yield hypotheses
• RF IPD die cost analysis
  • RF IPD die front-end cost
  • RF IPD die cost by process step
• Final test cost
• Component cost

Estimated Price Analysis

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