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RF Devices And Technology

RF Front-End Module Comparison 2021 - Volume 4 – Focus on WiFi 6/6E - Main Wifi 6.0 FEM - System Plus Consulting

RF Front-End Module Comparison 2021 – Volume 4 – Focus on WiFi 6/6E

Published
30/11/2021
Product code
SPR21591
Price
EUR 6990
Applications
Mobile & Consumer
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Technical and cost overview of the latest radio frequency connectivity front-end technologies, with a deep analysis of Wi-Fi 6/6E architecture.

RF Front-End Module Comparison 2021 - Volume 4 – Focus on WiFi 6/6E - Main Wifi 6.0 FEM - System Plus Consulting

Each year, System Plus opens hundreds of front-end modules (FEMs) and components in select flagship smartphones to provide an overview of the radio frequency (RF) FEM market. Gathering the information into one report offers an opportunity to  track the evolution of this technology market.

This year, System Plus Consulting proposes different volumes of technical and cost comparisons of smartphones’ RFFEM. Each report focuses on a specific subject: this  can be a player’s evolution, a specific technology, or a comparison of flagship devices.

This fourth volume provides insights into technology and cost data for Wi-Fi chipsets – specifically, the SoC, FEMs, and several components found in four of the  latest smartphones: the Huawei P50 Pro, iPhone 13 Pro Max, Samsung Galaxy S21 5G, and Xiaomi Mi 11 Ultra. This report features a comprehensive overview of the connectivity architecture on the market, comparing Wi-Fi AC (aka 5.0) to Wi-Fi AX (aka 6/6E). As the architecture is central on the SoC, PAs, switches, and LNAs, a detailed analysis (including a cross-section and technology analysis) is also provided. Furthermore, different choices of architecture are revealed between Mediatek, Broadcom, Qualcomm, and Huawei.

With teardowns of these smartphones, the main RF modules and components were extracted and physically analyzed – from the output of the transceiver to the antenna. Packaging, sizes, and technologies were studied to provide a large panel of technical and economical choices, and an overview of the market is provided as well.

This  report includes an overview of other flagship smartphones released by the end of 2020/beginning of 2021 and furnishes a statistical analysis for most of the connectivity modules. An explanation of the smartphone makers’ choices and supplier tendencies is also provided. Analysis of front-end modules for LTE and 5G  is not included in this report.

RF Front-End Module Comparison 2021 - Volume 4 – Focus on WiFi 6/6E - Cross-Section of a PA Die-Section - System Plus Consulting RF Front-End Module Comparison 2021 - Volume 4 – Focus on WiFi 6/6E - System-in-package Cross-Section - System Plus ConsultingRF Front-End Module Comparison 2021 - Volume 4 – Focus on WiFi 6/6E - Samsung's Wifi FEM Opening - System Plus Consulting
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Overview / Introduction

Company Profile

  • RFFE & Connectivity Market Forecast
  • Current Supplier Landscape
  • Smartphone and OEM Market Share
  • Apple, Samsung, Huawei, Xiaomi
  • Smartphones Teardown:
    iPhone 13 Pro Max, Galaxy S21 Ultra 5G, P50 Pro, Mi 11 Ultra
  • Summary of the analyzed RF components
  • Comparative Analysis:
    Module in Connectivity, Connectivity Area, Design Win, Main Supplier,
    Function, OEMs main Supplier

Physical Comparison 

  • Area Distribution per Supplier & Function
  • Area Distribution per Supplier & Function for Wifi 6/6E
  • Die Design Win in Number & Area
  • Die Distribution per Function
  • Die Distribution per Function for Wifi 6/6E
  • Filter Distribution per Smartphone: Technology and Substrate
  • PA/LNA/Switch Distribution per Smartphone: Technology and Substrate
  • Material Substrate Distribution per Smartphone

Cost Comparison     

  • Cost Distribution per Supplier & Function

Physical & Cost Analysis      

  • Huawei – Front-End Analysis
  • Huawei P40 Pro vs. Huawei P50 pro – Archi. Wifi 6+
    • Hi1105V100 Die Analysis
    • Package View & Dimensions
    • Package Opening & Cross-Section
    • Die View And Dimensions
    • Die Delayering & Main Block IDs
    • Hi1105V100 vs. Hi1103V110
    • P50 Pro Front-End Analysis
    • P40 Pro vs. P50 pro Chipset Physical and Cost Breakdown
  • Apple – Front-End Analysis
  • iPhone 11 Pro Max vs. iPhone 12/13 Pro Max – Wifi 6
    • USI 339S00761 Dies Analysis
    • iPhone 13 Pro Max Front-End Analysis
    • iPhone 11 vs. iPhone 12/13 Chipset Physical and Cost Breakdown
  • Samsung – Front-End Analysis
  • Samsung Galaxy S20 Ultra 5G vs. Galaxy S21 Ultra 5G – Archi. Wifi 6 to 6E
    • SEMCO 2515D1 Dies Analysis
    • Galaxy S21 Ultra 5G Front-End Analysis
    • S20 Ultra 5G vs. S21 Ultra 5G Chipset Physical and Cost Breakdown
  • Xiaomi – Front-End Analysis
  • Mi 10 Ultra vs. Mi 11 Ultra – Archi. Wifi 6 to 6E
  • WCN6851 Analysis

Mi 11 Ultra Front-End Analysis

Mi 10 Ultra vs. Mi 11 Ultra Chipset Physical and Cost Breakdown

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