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RF Front-End Module Comparison 2020 – Volume 4

Product code
EUR 6 490
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Technical and cost overview of the latest radio frequency front-end module technologies integrated in Asian based smartphone manufacturers.

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Each year System Plus opens hundreds of Front-End Modules (FEMs) and components to provide an overview of the Radio Frequency (RF) FEM market in selected flagship smartphones. Gathering the information into one report offers an opportunity to keep track of the evolution of this technology market.

This fourth volume provides insights into technology and cost data for FEMs and several components found in 19 Asian based latest smartphones: from Asus, HTC, Huawei, Oppo, OnePlus, Vivo, Sharp, ZTE, Xiaomi and Realme. It features a comprehensive overview of the RFFE architecture on the market, comparing available smartphones from these companies. Components dependency of the Asian OEMs are revealed along the different choice in integration of 5G technology even mmWave support. Also, it reveals how supplying companies offers the same type of components: similar prices, structure or even design.

With teardowns of the smartphones, the main RF modules and components have been extracted and physically analyzed, from the output of the transceiver to the antenna. Packaging, sizes, and technologies are studied to provide a large panel of technical and economical choices and an overview of the market.

Moreover, the report includes an overview of other flagship smartphones released from Q3 2019 to Q2 2020 and provides a statistical analysis for most of connectivity modules. It also tries to explain the smartphone makers’ choices and supplier tendencies. Wifi and Connectivity Module analysis is not included in this report.

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Company Profile: Huawei, OnePlus, Oppo, Vivo, Xiaomi, ZTE

Smartphone Teardowns

Huawei P40 Pro, OnePlus 8 5G, Oppo Reno3 5G, Vivo X30 Pro 5G, Xiaomi Mi 10 Pro, ZTE/Nubia Red Magic 5G

Physical and Cost Analysis

  • Broadcom – Front-end analysis
    • OnePlus 8 5G – RFFE architecture
      • AFEM-9206 analysis
        • Packages view and dimensions
        • Packages opening & cross-section
        • Die view and dimensions
        • Estimated bloc diagram
      • AFEM-9206 vs. AFEM-8100
  • HiSilicon – Front-end analysis
    • Huawei P40 Pro – RFFE architecture
      • Front-end analysis
      • Hi6HD05V100 vs. SKY77643-61
  • Murata – Front-end analysis
    • Huawei P40 Pro – RFFE architecture
      • Front-end analysis
      • 429 vs. SKY58255
  • Qorvo – Front-end analysis
    • Vivo X30 Pro vs. Xiaomi Mi 10 Pro 5G vs. Huawei P40 Pro – RFFE architecture
      • Front-end module analysis
      • QM75005 vs. SKY58254-11
  • Qualcomm – Front-end analysis
    • OnePlus 8 5G vs. Xiaomi Mi 10 Pro 5G vs. ZTE/Nubia Red Magic 5G – RFFE architecture
      • Front-end module analysis
      • QPM5679 vs. Hi6D03V100
  • Skyworks – Front-end analysis
    • Oppo Reno3 5G – RFFE architecture
      • Front-end module analysis
      • SKY58254-11 vs. QPM6585

Comparison Analysis

  • Integration Comparison including Area per Supplier, Area per Function and Filters
  • Material Comparison including Substrate and Silicon Consumption
  • Cost Comparison per Supplier and per Function
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