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SP20523-Main Wifi 6.0 SoC

RF Front-End Module Comparison 2020 – Volume 3

Published
01/10/2020
Product code
SP20523
Price
EUR 6 490
Applications
Consumer
Available sample Available flyer Ask for info

Technical and cost overview of the latest Radio Frequency connectivity Front-End technologies, with deep analysis of Wifi 6.0 and Ultra-Wide Band architecture.

SP20523-Main Wifi 6.0 Chipset_logo

Each year System Plus opens hundreds of Front-End Modules (FEMs) and components to provide an overview of the Radio Frequency (RF) FEM market in selected flagship smartphones. Gathering the information into one report offers an opportunity to keep track of the evolution of this technology market.

This year, System Plus Consulting offers different volumes on technical and cost comparisons of smartphone RFFEMs. Every report will focus on a specific subject, either a player’s evolution, a specific technology or a comparison of flagship devices.

This third volume provides insights into technology and cost data for FEMs and several components found in 14 latest smartphones made by companies from Apple to Xiaomi. It features a comprehensive overview of the connectivity architecture on the market, comparing Wifi ac/5.0 to Wifi ax/6.0. As the architecture is centered on the Systems-on-Chips (SoCs), that’s what we’ve done a detailed analysis with cross-section and technology analysis on. Different choices of architecture are revealed between Mediatek, Broadcom, Qualcomm, and Huawei. Additionally, the analysis provides insight into Apple’s Ultra Wide Band (UWB) technology from the antenna to the SoC.

With teardowns of the smartphones, the main RF modules and components have been extracted and physically analyzed, from the output of the transceiver to the antenna. Packaging, sizes and technologies are studied to provide a large panel of technical and economical choices and an overview of the market.

Moreover, the report includes an overview of other flagship smartphones released by the end of 2019 and provides a statistical analysis for most connectivity modules. It also tries to explain the smartphone makers’ choices and supplier tendencies. Analyses of FE modules for LTE and 5G modules are not included in this report.

SP20523-Main Wifi 6.0 SoC SP20523-Main System-in-Package Technology for Connectivity_logo
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Overview/Introduction

Company Profile: Apple, Samsung, Huawei, Oppo, OnePlus, LG, Google

Smartphone Teardowns

Apple iPhone 11, Samsung Galaxy Note10+, Huawei P40 Pro, Oppo Reno3 5G, Google Pixel 4XL, LG V60 ThinQ, OnePlus 8

Physical Analysis

  • HiSilicon – Front-End Analysis
    • Huawei Mate 20 X (5G) vs. Huawei P40 pro – Architecture Wifi 5.0 vs. 6.0
      • Hi1105V100 analysis
        • Package views and dimensions
        • Package opening and cross-section
        • Die view and dimensions
        • Die delayering and main block IDs
        • Die process
    • oHi1105V100 vs. Hi1103V110
  • Mediatek – Front-End Analysis
    • HTC desire 19s vs. Oppo Reno3 5G
      • MT6635 analysis
      • MT6635 vs. MT6631N
  • Qualcomm – Front-End Analysis
    • Samsung Galaxy M11 and OnePlus 7 pro 5G vs. OnePlus 8 5G – Architecture Wifi 4.0 to 6.0
    • Google Pixel 4XL vs. LG V60 ThinQ – Architecture Wifi 6.0 module
      • Murata 1VF and QCA6391 analysis
      • QCA6391 vs. WCN2998 vs. WCN3615
  • Broadcom – Front-End Analysis
    • Apple iPhone SE (2020) vs. Galaxy Note10+ vs. Apple iPhone 11 Pro Max – Architecture Wifi 6.0 module from Murata, USI and Samsung
      • SEMCO 4005C2, USI APPL339S00648, Murata 1VC and BCM4378
      • BCM4378 vs. BCM4377
  • Apple UWB – Front-End Analysis
    • USI U1 and antenna analysis

Comparison Analysis

  • Integration Comparison Including Area per Supplier, Area per Function and Filters
  • Material Comparison Including Substrate and Silicon Consumption
  • Cost Comparison per Supplier and per Function
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