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Samsung Galaxy S6 Teardown & Physical Analyses of Key Components

Published
01/10/2015
Product code
SP15228
Price
EUR 2 490
Applications
Consumer
Available sample Available flyer Ask for info

The Samsung Galaxy S6 holds many IC components which are listed and reviewed in the report. A special focus has been made to highlight the component structure and understand the manufacturing process on 11 “notable” components among 4 selected topics: Advanced packaging, MEMS/Sensor, RF and Imaging.

Five MEMS/Sensors components

  • Fingerprint sensor – second generation
  • eCompass – new reference which has never been used in a smartphone and smallest eCompass on the market
  • OIS gyroscope – smallest gyroscope on the market
  • Heart-rate monitor sensor and color, ambient light and proximity sensor rarely integrated in a smartphone

Imaging components

  • Front and rear camera modules as well as flash LED

Two packaging components

  • Samsung Exynos Processor – advanced Package-on-Package (PoP) structure
  • Samsung power management IC – smallest pitch Wafer-Level Package (WLP) on the board

One RF component

  • Wi-Fi & Bluetooth combo module flip-chip BGA SiP integrating the industry’s most powerful 5G WiFi combo chip
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Executive Summary

Reverse Technology Methodology

Samsung Galaxy S6 Teardown

Electronic Board

  • High Resolution Pictures
  • ICs Identification
    • ICs Identification (mfr., ref., fcn., pkg. type, size & pin count)
    • Unknown Components Decapsulation
    • Repartition by package type
    • Mfr. Design wins ranking
    • ICs footprint ranking
  • PCB Characteristics
    • PCB Cross-Section
    • PCB min. line width

Advanced Packaging

  • Samsung Exynos PoP
    • Package views & dimensions
    • Package Cross-Section
    • Package Opening
      • Processor & DRAM dies measurement
  • Samsung smallest pitch WLP
    • Package views & dimensions
    • Package Cross-Section

MEMS/Sensors

  • Fingerprint Sensor
    • Button Assembly View
    • Fingerprint sensor views & dimensions
    • Fingerprint sensor Cross-Section
    • Sensor die measurement
  • 3-Axis eCompass
    • Package views & dimensions
    • Package Cross-Section
    • Die measurement
    • Sensor Details
  • OIS Gyroscope
    • Assembly in camera module
    • Package views & dimensions
    • Package Opening & Die measurement
    • MEMS opening & sensor details
    • Cross-Section
  • Pulse Oximetry & Heart-Rate Monitor Sensor
    • Package views & dimensions
    • Package Opening & Die measurement
  • Color, ALS and Proximity Sensor
    • Package views & dimensions
    • Package Opening & Dies measurement

RF Devices

  • 5G Wi-Fi & Bluetooth Combo Chip
    • Package views & dimensions
    • Package Opening & Dies measurement

Camera Modules & Flash LED

  • 16Mp Rear Camera Module
    • Module views & dimensions
    • Module Opening & CIS die measurement
    • Module Cross-Section
  • 5Mp Front Camera Module
    • Module views & dimensions
    • Module Opening & CIS die measurement
    • Module Cross-Section
  • Flash LED
    • Package views & dimensions
    • Package Opening & LED die measurement
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