Follow us :

IC & RF RF IC

Qualcomm 5G mmWave Chipset Second Generation - System Plus Consulting

Qualcomm’s Second Generation 5G mmWave Chipset, from Modem to Antenna

Published
07/05/2020
Product code
SP20517
Price
EUR 3 990
Applications
Consumer
Available sample Available flyer Ask for info

A study of the complete second generation of the 5G millimeter-wave chipset for handset applications, including the baseband modem SDX55M, the transceiver SMR526 and Antenna-on-Package QTM525.

Qualcomm 5G mmWave Chipset Second Generation - System Plus Consulting

The 5G revolution is here. We are currently seeing uptake of the technology led by the Sub-6GHz frequency range application. Qualcomm, one of the major players in this segment, has claimed over 230 design wins in development or already launched on the market. Only a small fraction of these smartphones is 5G millimeter wavelength (mmWave) range compatible, mainly represented by Samsung. Last year, Samsung released its mmWave version of its flagship Galaxy S10 5G in America in partnership with Qualcomm, which supplies the complete chipset. This year, Samsung renewed the partnership and is offering the latest generation of Qualcomm’s 5G mmWave chipset in its Galaxy S20 Ultra 5G.

Like the previous generation, the complete solution has been especially designed for smartphone applications, starting with Samsung and expected to spread to others designs. The module in the Samsung Galaxy S20 Ultra 5G comes with five systems spread throughout the smartphone. The first System-in-Package (SiP) is the baseband processor, which uses standard Ball Grid Array (BGA) SiP Packaging. The second is the 5G mmWave receive/transmit (Rx/Tx) which uses standard flip-chip ball grid array (FCBGA) packaging. The other systems are combined in the antenna-on-package (AoP) module, which is spread around the corner of the smartphone in order to provide spherical coverage without any hand-blocking constraints.

Two versions of the antenna modules are integrated into the flagship. The first version comes with a dipole antenna coupled with a patch antenna system. The patch antenna system is designed to provide wide-band polarized radiation. Among the innovations in the antenna design, Qualcomm seems to integrate two types of antenna patch in the same form factor. One is a Coupled Feed Antenna, and one is a Dual-Polarized and Dual Band Patch Antenna. Moreover, the design in the routing, in the filtering and in the transceiver has led to a better stability in terms of power emission.

This report includes a full investigation of the system, featuring a detailed study of the SiPs, including die analyses, processes and board cross-sections. It contains a complete cost analysis and a selling price estimation of the system. Finally, it features a technical and cost comparison with the structure of the first generation of 5G mmWave chipset from Qualcomm.

Qualcomm 5G mmWave Chipset Second Generation - System Plus Consulting Qualcomm 5G mmWave Chipset Second Generation - System Plus Consulting Qualcomm 5G mmWave Chipset Second Generation - System Plus Consulting

 

Back to top

Overview/Introduction

Company Profile and 5G Technology

Samsung Galaxy S20 Ultra 5G Teardown

Market Analysis

Physical Analysis

  • Physical Analysis – Methodology
  • Module analysis
    • Module view: Dimensions, marking, integration and block diagram
  • Baseband processor and Rx/Tx Package analysis
    • Package view and dimensions, opening and bill of material, cross-section: PCB, dimensions and process analysis
  • Antenna SiP analysis: V1 and V2
    • Package view and dimensions, opening and bill of material, cross-section: PCB, dimensions and process analysis
    • Package X-Ray: overall view, PCB routing, antenna structure, cross-sections
  • Die Analysis: Baseband processor, Rx/Tx, transceiver, PMIC
    • Die view and dimensions, delayering and main block IDs, cross-section and process
  • Physical analysis comparison
    • Qualcomm’s first vs. second generation of 5G mmWave chipsets

Manufacturing Process Flow

  • Die fabrication unit: Baseband processor, Rx/Tx, transceiver, PMIC
  • SiP packaging fabrication unit
  • PCB & AoP fabrication process flow

Cost Analysis

  • Overview of the cost analysis
  • Supply chain description
  • Yield hypotheses
  • Die cost analyses: Baseband Processor, Rx/Tx, Transceiver, PMIC
    • Front-End (FE) cost
    • Wafer and die cost
  • Baseband, Rx/Tx and Antenna Package Cost Analysis
    • Packaging assembly cost
    • Packaging cost by process step
  • Final test cost and assembly
  • Component cost
  • Cost analysis comparison
    • Qualcomm’s first vs. second generation of 5G mmWave chipsets

Estimated Price Analysis

Back to top
© Copyright 2020 SYSTEM PLUS CONSULTING SARL l Tous droits réservés l Legacy Mentions