IC & RF RF IC

Qualcomm VIVE® QCA9500 High Density WiGig/WiFi 802.11ad Chipset for the 60 GHz Band

Published: 17/01/2018
Product code: SP18374
Price: EUR 3 990
Applications: Automotive Consumer Industrial

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Introduction
Summary
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Disruptive double side molded system-in-package-based chipset for millimeter-wave applications targeting consumer devices, including integrated antennae.

2018 will be a key milestone in the journey towards 5G communication. Several areas, from semiconductor to packaging, will improve their technologies to be suitable for 5G deployment. We now know that the 5G frequency will be in the millimeter wave (mmWave) range. In this band, the IEEE has already licensed a Wifi 802.11 protocol, known as WiGig. Using 7 GHz of bandwidth in the 60 GHz band, it allows gigabit data-rates similar to wired communication. Only two main players share this upcoming market, Intel and Qualcomm. And as a pioneer in 5G development, Qualcomm is now offering a WiGig chipset. It provides an early glimpse of 5G mobile user experiences and technologies using an innovative System in Package (SiP) approach in the VIVE® QCA9500.

SP18374 - Qualcomm QCA9500 60 GHz Chipset - System Plus Consulting

This complete solution serves both mobile computer devices and access points, specifically routers. The module comes with two boards linked by a coaxial connection. The first board features a radio frequency integrated circuit (RFIC) and innovative antennae, and the second features an advanced SiP with a double sided molding configuration. The SiP integrates a baseband (BB) processor along with a switch, a regulator, a crystal, memory and more than 60 surface mounted device (SMD) components, all in a single package smaller than 40 mm². This is the first double side molded device we found in the market, and it could be a key milestone for 5G SiP technology.

Developed by Wilocity, which has been a Qualcomm subsidiary since 2014, the RFIC features up to four transceivers controlling up to 32 antennas, both patch and quasi-Yagi-type, for the beamforming at 60 GHz. The SiP uses non-conventional molded packaging developed by Amkor. It has innovative interconnections, enabling the redistribution of the BB processor signal to the printed circuit board (PCB). Copper pillars inside the molding and a very thin confined PCB substrate complete the signal distribution structure.

This report includes a full investigation of the module, featuring a detailed study of the SiP and the antenna board including die analyses, processes and board cross-sections. Finally, it contains a complete cost analysis and a selling price estimation of the system.

Overview / Introduction

Company profile & WiGig technology

TP-LINK Talon AD7200 Teardown

Physical Analysis

Physical analysis methodology
Module analysis
- Module view and dimensions
- Module marking and block diagram
Baseband board analysis
- Board disassembly
- Board bill of material
- Board cross-section
Baseband SiP analysis
- Package view and dimensions
- Package opening: Copper pillar, bill of material
- Package cross-section: PCB, copper pillar, dimensions
- Package process analysis
Die analysis: Baseband processor, switch, regulator, memory
- Die view and dimensions
- Die cross-section
- Die process
Physical analysis comparison
- SiP vs discrete
Antenna board analysis
- Board disassembly
- Board bill of material
- Board cross-section
Die analysis: RFIC
- Die view and dimensions
- Die cross-section
- Die process

Manufacturing process flow

Die fabrication unit: Baseband processor, RFIC
Packaging fabrication unit
SiP package process flow

Cost analysis

Overview of the cost analysis
Supply chain description
Yield hypotheses
Die cost analyses: Baseband processor, RFIC
- Front-end cost
- Wafers and die costs
SiP Package cost analysis
- SiP Front-end cost
- SiP Cost by process step
Final test cost
Final assembly
Component cost

Estimated Price Analysis