IC & RF RF IC

Disruptive double side molded system-in-package-based chipset for millimeter-wave applications targeting consumer devices, including integrated antennae.

2018 will be a key milestone in the journey towards 5G communication. Several areas, from semiconductor to packaging, will improve their technologies to be suitable for 5G deployment. We now know that the 5G frequency will be in the millimeter wave (mmWave) range. In this band, the IEEE has already licensed a Wifi 802.11 protocol, known as WiGig. Using 7 GHz of bandwidth in the 60 GHz band, it allows gigabit data-rates similar to wired communication. Only two main players share this upcoming market, Intel and Qualcomm. And as a pioneer in 5G development, Qualcomm is now offering a WiGig chipset. It provides an early glimpse of 5G mobile user experiences and technologies using an innovative System in Package (SiP) approach in the VIVE® QCA9500.

This complete solution serves both mobile computer devices and access points, specifically routers. The module comes with two boards linked by a coaxial connection. The first board features a radio frequency integrated circuit (RFIC) and innovative antennae, and the second features an advanced SiP with a double sided molding configuration. The SiP integrates a baseband (BB) processor along with a switch, a regulator, a crystal, memory and more than 60 surface mounted device (SMD) components, all in a single package smaller than 40 mm². This is the first double side molded device we found in the market, and it could be a key milestone for 5G SiP technology.

Developed by Wilocity, which has been a Qualcomm subsidiary since 2014, the RFIC features up to four transceivers controlling up to 32 antennas, both patch and quasi-Yagi-type, for the beamforming at 60 GHz. The SiP uses non-conventional molded packaging developed by Amkor. It has innovative interconnections, enabling the redistribution of the BB processor signal to the printed circuit board (PCB). Copper pillars inside the molding and a very thin confined PCB substrate complete the signal distribution structure.

This report includes a full investigation of the module, featuring a detailed study of the SiP and the antenna board including die analyses, processes and board cross-sections. Finally, it contains a complete cost analysis and a selling price estimation of the system.

                                    

Overview / Introduction

Company profile & WiGig technology

TP-LINK Talon AD7200 Teardown

Physical Analysis

• Physical analysis methodology
• Module analysis
  • Module view and dimensions
  • Module marking and block diagram
• Baseband board analysis
  • Board disassembly
  • Board bill of material
  • Board cross-section
• Baseband SiP analysis
  • Package view and dimensions
  • Package opening: Copper pillar, bill of material
  • Package cross-section: PCB, copper pillar, dimensions
  • Package process analysis
• Die analysis: Baseband processor, switch, regulator, memory
  • Die view and dimensions
  • Die cross-section
  • Die process
• Physical analysis comparison
  • SiP vs discrete
• Antenna board analysis
  • Board disassembly
  • Board bill of material
  • Board cross-section
• Die analysis: RFIC
  • Die view and dimensions
  • Die cross-section
  • Die process

Manufacturing process flow

• Die fabrication unit: Baseband processor, RFIC
• Packaging fabrication unit
• SiP package process flow

Cost analysis

• Overview of the cost analysis
• Supply chain description
• Yield hypotheses
• Die cost analyses: Baseband processor, RFIC
  • Front-end cost
  • Wafers and die costs
• SiP Package cost analysis
  • SiP Front-end cost
  • SiP Cost by process step
• Final test cost
• Final assembly
• Component cost

Estimated Price Analysis

• Qualcomm 60GHz WiGig/WiFi 802.11ad Chipset World’s First Smartphone Edition
• Broadcom AFEM-8092 System-in-Package in the Apple iPhone Xs/Xr Series
• Wafer to Wafer Permanent Bonding Comparison 2018
• Peraso X710 Chipset 60GHz Outdoor Wireless Broadband Solution
• GaN Systems GS61004B GaN HEMT
• MEMS Packaging: Reverse Technology Review
• NXP SCM-i.MX6 Quad High Density Fan-Out Wafer-Level System-in-Package
• Advanced packaging technology in the Apple Watch Series 4’s System-in-Package
• Ainstein K-77 Long Range Radar featuring Calterah CAL77A2T4R FOWLP Transceiver
• Samsung Exynos 9110 with ePLP: First Generation of Samsung’s Fan-Out Panel Level Packaging (FO-PLP)