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RF Devices And Technology

Qualcomm Thin-Film SAW Filter Technology in Diversity Module - QuSAW-Filter-Die - System Plus Consulting

Qualcomm Thin-Film SAW Filter Technology in Diversity Module

Published
02/02/2022
Product code
SPR22652
Price
EUR 6990
Applications
Mobile & Consumer
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A deep-dive analysis of Qualcomm’s QuSAW filter technologies, with novel wafer-level packaging enabling multiplexer on single die and engineered Piezo-on-Insulator substrate.

Qualcomm Thin-Film SAW Filter Technology in Diversity Module - QuSAW-Filter-Die - System Plus Consulting

According to Yole’s estimate, the filter market was almost $7B in 2021 – accounting for roughly half of the overall RF front-end market. As a critical component in the RF front-end, there are many innovations in the filter field to reduce cost and size while improving performance. One such innovation is the TF-SAW (thin film surface acoustic wave) filter, which is built on Piezo-on-Insulator substrates. Yole expects a 23% CAGR growth from 2021 – 2026 for TF-SAW filters and POI substrates. When it first appeared in 2019 in the Apple iPhone series, Murata’s TF-SAW filter shifted Apple’s supply chain. In 2020, Qualcomm joined the race to supply high-performance SAW filters. With its QuSAW technology, Qualcomm reinforced its position as a leader in integrated duplexer modules with Samsung.

For the Fan-Edition of the Samsung Galaxy S20 in 2020, Qualcomm supplied Samsung with two diversity modules that feature several multiplexers for mid-band (MB) and high-band (HB) diversity paths. The modules integrate several dies, including a low-noise amplifier (LNA) using RFSOI substrate and two versions of Qualcomm’s TF-SAW filters.

This report focuses on these two versions of Qualcomm’s TF-SAW, which were first manufactured for Samsung. The components use an innovative lithium tantalate wafer bonded to a silicon substrate using an oxide layer with two kinds of wafer-level packaging. The first one uses the well-known thin film acoustic packaging (TFAP) technology employed for several years at Qualcomm for TC-SAW and FBAR BAW filters. Meanwhile, the newly-developed second device allows for integrating the filter without any air cavities and simplifying the integration at its maximum level. This TF-SAW technology allows Qualcomm to produce quadplexer devices on a single die.

This report contains a deep analysis of the filter die, with a complete cost analysis of the component. A comparison with Murata’s IHP-SAW and Qualcomm’s TC-SAW and SAW filter technology is also furnished.

Qualcomm Thin-Film SAW Filter Technology in Diversity Module - Diversity-Module-Opening - System Plus Consulting Qualcomm Thin-Film SAW Filter Technology in Diversity Module - TF-SAW-Cross-Section - System Plus Consulting Qualcomm Thin-Film SAW Filter Technology in Diversity Module - Substrate-Overview - System Plus Consulting
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Overview / Introduction

  • Executive Summary
  • Reverse Costing Methodology

Company Profile

  • RFFEM Supply Chain & Market Forecast
  • Qualcomm Filter PortFolio
  • RF Filters Technology
  • Piezoelectric Filters Technology
  • Samsung Galaxy S20 FE Teardown

Physical Analysis

  • Summary of the Physical Analysis
  • Filter #1 – Package Assembly
    • Package Views and Dimensions
    • Package Opening & Cross-Section
  • Filter #1 Die
    • Filter Die Views & Dimensions
    • Filter Die Opening & Schematic
    • Filter Die Cross-Section
    • Filter Die Process Characteristics
  • Filter #2 – Package Assembly
    • Package Views and Dimensions
    • Package Opening & Cross-Section
  • Filter #2 Die
    • Filter Die Views & Dimensions
    • Filter Die Opening & Schematic
    • Filter Die Cross-Section
    • Filter Die TEM analysis
    • Filter Die Process Characteristics

Physical Comparison

  • Qualcomm TF-SAW Family
  • Qualcomm vs. Murata TF-SAW

Filter Manufacturing Process

  • Summary of the Main Parts
  • Filter Die Front-End Process & Fabrication Unit
  • Filter Die Process Flow
  • Final Test & Assembly

Cost Analysis

  • Summary of the Cost Analysis
  • Yields Explanation & Hypotheses
  • Filter Die
    • Wafer Process Cost
    • Wafer Front-End Cost
    • Wafer Back-End Cost
    • Filter Die Cost

Cost Comparison

  • Qualcomm TF-SAW Family
  • Qualcomm vs. Murata TF-SAW

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