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Package Cross Section - System Plus Consulting

Qualcomm Snapdragon 888 System on Chip with 5G Modem

Product code
EUR 6990
Mobile & Consumer
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Deep dive analysis of Qualcomm’s SoC architecture using Samsung 5nm process technology.

Package Cross Section - System Plus Consulting
Qualcomm has introduced its latest and most advanced system-on-chip (SoC), the Snapdragon 888, a powerful processor chip targeting flagship mobile phones. The Xiaomi Mi11 is the first smartphone to use the Snapdragon 888 5G Mobile Platform, and many others will follow. The Snapdragon 888 is the first SoC to integrate 5G modem functionality with processing cores rather than being a separate component.
Qualcomm switched its foundry supply back to Samsung for the Snapdragon 888 SoC. This device is the first Qualcomm product produced on the latest 5 nm process technology. The foundry shift by Qualcomm will continue the competition between Samsung and TSMC.
The 5 nm patterning process is advantageous for power efficiency, exceptional 5G multi gigabit speeds and improved battery life. The Snapdragon 888 architecture is complex, designed to cater to machine learning, image processing, gaming and 5G modem applications. Qualcomm claims that devices powered by the chip can capture multiple high resolution video streams simultaneously.
To reveal the details of Qualcomm’s SoC, this report includes a detailed physical analysis that reveals the SoC floorplan to understand the chip architecture and the IP block areas. Significant die area is devoted to the GPU, 5G Modem and machine learning core. The report includes a complete construction analysis using SEM cross-sections, material analyses and delayering. Also, a front-end of line analysis uses high-resolution TEM images to provide detail of the channel structure and materials. For the 5nm technology generation, the channel material is critical and a switch to a high mobility channel for the PMOS finFETs is underway for all wafer foundries. The back-end analysis uses CT scan 3D X-Ray to reveal the layout structure of the package including an external LPDDR5 memory package that is attached over the Snapdragon 888 package. The cost estimation includes the SoC front end process, packaging, and the component cost.

Snapdragon 888 SoC Die Cross section - System Plus Consulting Snapdragon Copper Pillars - System Plus Consulting DRAM Memory Package Opening - System Plus Consulting
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  • Executive Summary
  • Reverse Costing Methodology

Company Profile

Physical Analysis

  • Summary of the Physical Analysis
  • Smartphone Disassembly
  • Qualcomm Snapdragon and Memory Package
    • Package Dimensions
    • Package CT Scan (3D X-Ray) and Virtual Cross Section
  • DRAM Memory Analysis
    • Memory Package View
    • Memory Package Cross Section
    • Memory Package Opening
    • Memory Die Cross Section
    • Memory Process
  • Snapdragon 888 Analysis
    • Package Views
    • Package Cross Section
    • Snapdragon 888 Die
    • Snapdragon 888 Die Cross Section SEM and TEM Images
    • Snapdragon 888 Die Delayering
    • Snapdragon 888 Die Process
    • FEOL (TEM Images)
  • Snapdragon 888 Floor Plan Analysis

Manufacturing Process

  • Snapdragon 888 SoC Die Front-End Process and Fabrication Unit
  • Snapdragon 888 SoC Process Flow
  • DRAM Memory Process and Fabrication Unit

Cost Analysis

  • Overview of the Cost Analysis
  • Supply Chain Description
  • Memory DRAM Component
    • Memory Die Front-End Cost
    • Memory Component and Packaging Cost
  • Snapdragon SoC Die
    • Front-End Cost
    • Wafer and Die Cost
    • Package Cost Analysis
  • Final Test and Component Cost
  • Snapdragon 888 Component Price
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