IC & RF RF IC

Qorvo TQF6405 in iPhone 6s Plus

Published: 10/03/2016
Product code: SP16254B
Price: EUR 2 990
Applications: Consumer

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Introduction
Summary
Similar reports

Qorvo started as a supplier for Apple’s iPhone with the first iPhone 3G. Since then Apple has been integrating Qorvo’s Module in its flagship. In iPhone 6s series, Apple integrates Qorvo’s LTE High Band Front-End Module.

The merge of Triquint and RFMD in Qorvo formed a top competitor in wireless communication specially in SMR BAW filter.

Located on the main board of the Apple iPhone 6s Plus smartphone, the Qorvo TQF6405 is a complete Front-End Module for high band LTE application. The component is made with several filter dies, assembled on a coreless PCB substrate. It integrates many technology like copper pillar, SMR-BAW filter, proprietary of Qorvo.

All dies present in the component uses TriQuint’s proven front-side Cu/Sn pillar technology (Cu-Flip™) for simplified assembly and low interconnect inductance, allowing the assembly of all components of the Front-End Module on the same chip with an area of less than 35 mm².

Specific air cavities are made around each resonator before copper pillar fabrication to preserve any losses.

Thanks to its design and manufacturing process, Qorvo device is not sensitive to temperature and is cost effective in respect to its competitors.

The report includes comparisons with the BAW filter from Avago, also found in the Apple iPhone 6s Plus.

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Physical Analysis Methodology
Front-End Module disassembly
- Front-End Module Removal
- Front-End Module assembly view

Front-End Module assembly
- Front-End Module Views
- Front-End Module Cross-Section

Front-End Module Die
- Active device Die View & Dimensions
- Power Amplifier Cross-section
- SPDT switch Cross-Section

BAW filter Die
- BAW filter Die View & Dimensions
- BAW filter Die Opening
- BAW filter Die packaging cross-section
- BAW filter Die Copper Pillar & Cavity
- BAW filter Die Cross-section
- BAW filter Die membrane

Manufacturing Process Flow

Front-End Module Die Front-End Process
Component Packaging Process
Fabrication unit
MEMS wafer process flow
- SMR process Flow
- Air cavity & Copper Pillar process flow

Final Test & Packaging
Synthesis of the main parts

Cost Analysis

SMR-BAW Filter Wafer Front-End Cost
SMR-BAW Filter Wafer Front-End Cost per process
SMR-BAW Filter Front-End Probe Test, Thinning & Dicing Cost
SMR-BAW filter Die Cost
Estimated Manufacturer Price

Technology and Cost comparison with Avago’s BAW filter