Imaging

pmd/Infineon’s 3D Indirect Time-of-Flight in LG G8 ThinQ

Published: 11/09/2019
Product code: SP19468
Price: EUR 3 990
Applications: Consumer

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Introduction
Summary
Similar reports

World-first Front Facing 3D Indirect ToF camera in the LG G8 ThinQ smartphone, with NIR 3D Camera and flood illuminator.

The new pmd/Infineon REAL3 image sensor, reference IR 2381C, offers more than simple face authentication for the LG G8 ThinQ smartphone. The indirect Time-of-Flight (ToF) camera and the flood illuminator allow face recognition, and also the recognition of the palm vein patterns. Moreover, the ToF module is used for the new ‘Bokeh’ smartphone photography mode. Bokeh allows users to take pictures without blur in real-time. Lastly, the new indirect ToF module allows users to interact with the phone without touching it, using hand gestures.

The ToF Module in the LG G8 smartphone is based on the REAL3 image sensor, a Near Infra-Red (NIR) sensor and a flood illuminator, using a new-generation Vertical Cavity Surface Emitting Laser (VCSEL) die from ams AG. The total solution is designed by pmd.

This report is focused on the analysis of the 3D depth-sensing camera, comprising the NIR ToF camera module with REAL3 CMOS and the flood illuminator. This new NIR image sensor is 40% smaller than the 2016 module from Lenovo Phab2Pro, with the same 224×172 pixel definition. This is coupled with the new generation of the VCSEL laser die from ams AG, which is 12% smaller than the last generation. The new VCSEL electrode has been re-designed, and the cavity diameter reduced by 15%.

This report analyzes the complete 3D indirect ToF camera, provided along with cost analysis and price estimation for the module.

It also includes a physical and technical comparison with other 3D camera systems, such as the pmd/Infineon ToF image sensor in the Lenovo Phab 2 Pro, and the Panasonic MN34906 charge-coupled device (CCD) ToF image sensor in the Vivo Nex Dual Display. The comparison looks at system integration, the NIR camera module and the illuminator architecture.

Overview/Introduction

Panasonic Company Profile

LG G8 ThinQ – Teardown and Market Analysis

Physical Analysis

Physical Analysis Methodology
3D Sensing System Disassembly and Cross-Section
Flood Illuminator
- View, Dimensions and Cross-Section
NIR VCSEL Dies
- View, Dimensions, Pixels, Delayering and Main Block IDs
- Process and Cross-section
NIR ToF Module
NIR Camera ToF Sensor Die
- View, and Dimensions
- Die Processes and Cross-Sections
Physical Data Summary

Manufacturing Process Flow

Die Fabrication Unit: NIR Image Sensor, NIR VCSEL,
NIR Image Sensor and VCSEL Process Flow

Cost Analysis

Cost Analysis Overview
Supply Chain Description and Yield Hypotheses
NIR Image Camera Module Cost
- Front-End (FE), Microlens and Total FE Cost
- Wafer and Die Cost
NIR Flood Illuminator Cost
- Front-End (FE) Cost
- Front-End Cost per Process Step
- Wafer and Die Cost
ToF Module
- Lens Module and Diffuser Cost
- Assembly Cost

Estimated Price Analysis: NIR Camera Module, Flood Illuminator Module, and Optical Hub

Comparison between LG G8 and Lenovo Phab2Pro and Vivo Nex Dual Display

System Integration
NIR Camera Module and ToF Sensor
Flood Illuminator and VCSEL