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Peraso X710 Chipset 60GHz Outdoor Wireless Broadband Solution

Product code
EUR 3990
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SiGe based millimeter-wave chipset commercially available for backhaul applications with beamforming capability.

Even though millimeter-wave (mmWave) technology has become better defined this year, several questions remain unanswered. How will the technology be implemented? Which manufacturing technology will be used? Will it be used in cellphone handsets? Which companies will prevail in the market? Today, the only glimpse of what could be done in the near future is the WiGig application, which spans handsets, routers and backhaul products. Qualcomm is already in prime position in radio-frequency (RF) CMOS technology in handset applications. But for backhaul, where the power and performance requirements are higher, there’s room for other technologies and competitors. Peraso Technologies is one that is already well positioned, with several design wins for its X710 chipset.

Peraso Technologies’ three product series target consumer, industrial and augmented and virtual reality (AR/VR) applications. The X series chipset for outdoor wireless broadband solutions is composed of two separate components, a baseband integrated circuit (IC) and an RFIC. Integrated into the IgniteNet ML-690-LW device, the solution features also a ceramic substrate-based phase array antenna.  Soldered on the same board as 32 antennae, the all-60GHz solution takes up only 5% of the device volume.

This report includes a full investigation of the system, featuring a detailed study of the baseband processor, the RFIC and the antenna board including die analyses, processes and board cross-sections. We focus on the RFIC block diagram and the antenna board routing view and dimensions. The report contains a complete cost analysis and a selling price estimation of the chipset. Finally, it features an exhaustive comparison with the Qualcomm chipset for router and handset applications.

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Company Profile and WiGig technology

IgniteNet ML-60-LW teardown

Market Analysis

Physical Analysis

  • Physical analysis methodology
    • Board view and dimensions
    • Board marking and disassembly
    • Board cross-section
  • Baseband IC and RF IC package analysis
    • Package view and dimensions
    • Package X-ray: connection
    • Package cross-section: PCB, copper pillar, dimensions
    • Package process analysis
  • Die analysis: Baseband processor and RF IC
    • Die view and dimensions
    • Die overview and main blocks ID: VCO, LAN, PA, Tx/Rx channels
    • Die delayering and main blocks ID: SRAM, ROM, digital, analog
    • Die cross-section: SiGe HBT transistor, CMOS transistor, metal layers
    • Die process
  • Antenna board analysis
    • Board view and dimensions
    • Board deconstruction: X-ray, via and line dimensions, ground planes
    • Board cross-section
    • Board process
  • Physical analysis comparison
    • Peraso chipset – baseband vs. RFIC packaging
    • Peraso vs. Qualcomm chipset – baseband IC, RFIC, antennae
    • Backhaul vs. router vs. handset – chipset, form factor

Manufacturing process flow

  • Die fabrication unit: Baseband processor, RFIC
  • Packaging fabrication unit
  • Exposed die FCBGA package process flow

Cost Analysis

  • Overview of the cost analysis
  • Supply chain description
  • Yield hypotheses
  • Die cost analyses: Baseband processor, RFIC
    • Front-end cost
    • Wafers and die costs
  • Baseband and RFIC package cost analysis
  • Final test cost
  • Component coste Grating

Estimated price analysis

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