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Panasonic’s first 600V GaN HEMT has an innovative structure designed to integrate a normally-off transistor in a standard package, without a cascade structure.

Panasonic PGA26C09DV 600V GaN HEMT

Product code
EUR 3 490
Consumer Industrial
Available sample Available flyer Ask for info

System Plus Consulting unveils Panasonic’s first GaN HEMT, assembled in a standard TO220 package. Thanks to its specific die design, the component is normally-off without using a cascode structure or special packaging.

Panasonic’s PGA26C09DV features a medium-voltage breakdown of 600V for a current of 15A (25°C), with very low RdsOn compared to its competitors. The transistor is optimized for AC-DC power supply, photovoltaic, and motor inverters.

The GaN and AlGaN layers are deposited by epitaxy on a silicon substrate. A complex buffer and template layer structure is used to reduce stress and dislocation. This is complemented by a thick superlattice structure clearly visible in the TEM analysis.

Based on a complete teardown analysis, this report also provides a production cost estimate for the epitaxy, HEMT, and package.

Moreover, this report offers a comparison with GaN Systems’ GS66504B and Transphorm’s GaN HEMT, highlighting the huge differences in design and manufacturing process and their impact on device size and production cost.

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Overview / Introduction

  • Executive summary
  • Reverse costing methodology

Company Profile

  • Panasonic

Physical Analysis

  • Synthesis of the physical analysis
  • Package analysis
    • Package opening
    • Package cross-section
  • HEMT die
    • HEMT die view & dimensions
    • HEMT die process
    • HEMT die cross-section
    • TEM epitaxy  analysis
    • HEMT die process characteristics

HEMT Manufacturing Process

  • HEMT die front-end process
  • HEMT die fabrication unit
  • Final test & packaging fabrication unit

Cost Analysis

  • Synthesis of the cost analysis
  • Yield explanations and hypotheses
  • HEMT die
    • HEMT die front-end cost
    • HEMT die probe test, thinning, and dicing
    • HEMT die wafer cost
    • HEMT die cost
    • Wafer cost evolution
    • Die cost evolution
  • Complete HEMT
    • Assembly cost
    • Synthesis of the assembly
    • Component cost

Price Analysis

  • Estimated sales price


  • Comparison between Transphorm and GaN Systems’ HEMT

Company Services

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