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NXP MR2001

Product code
3 290€
Available sample Available flyer Ask for info

NXP (formerly Freescale), a leader in Integrated Circuits for ADAS 77 GHz Radar, introduced in 2015 a new chipset for complete system-level radar solution using new Freescale’s Fan-Out RCP packaging.
The transceiver chipset is scalable for multi-channel operation enabling a single radar platform with electronic beam steering and wide field-of-view for auto safety, communications infrastructure, and industrial systems.

In 2015, Continental announced that its current generation ARS 400 Long Range Radar Sensor incorporates Freescale’s MR2001 77 GHz multichannel radar transceiver and MPC577xK microcontroller with integrated radar signal ADC’s and a dedicated radar DSP.
The entire chipset uses the Fan-Out Wafer Level Package developed by Freescale called RCP. This package has no wire bonding to reduce inductance and a specific design to increase the heat management.

Due to Freescale innovation, the RCP package is robust enough to be installed in front automotive module.
The radar dies are manufactured with the newest and most advanced process from NXP/Freescale merging RF-Transistor SiGe:C xHBT and 0.18 µm CMOS transistor.
The report includes a complete analysis of the entire MR2001 chipset (MR2001RVK Receiver, MR2001TVK transmitter and MR2001VVK VCO components).

The report also features a full comparison with the Infineon 77 GHz radar chipset, included in the Bosch MRR1Plus. In addition, a complete comparison between Infineon’s Fan-Out eWLB and NXP/Freescale’s Fan-Out RCP packaging giving both technical choice and the result on the process flow.

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Overview/ Introduction

Company Profile

  • Physical analysis
  • Module Analysis
  • Redistributed Chip Package Analysis
    • View, Dimensions & Marking
    • Chipset Package Overview
    • RCP Cross-Section
    • RCP Redistributed Layer
  • Rx, Tx and VCO Die Analysis
    • View, Dimensions, and Marking
    • Die RF Main Blocks ID
    • Die Delayering and Digital/Analog Main Blocks ID
    • Details Function
    • Modules Overviews
  • Die Common Module Analysis
    • State Machine Module Analysis
    • SPI Module Analysis
    • Voltage Regulation Analysis
  • Die Cross-Section
    • SiGe:C xHBT Transistor CrossSection
    • Process Characteristics

Manufacturing Process Flow

  • Manufacturing Process Flow
  • Global Overview
  • SiGe Die Process & Wafer Fabrication Unit
  • RCP Process Flow & Fabrication Unit

Cost Analysis

  • Economic Analysis: Main Steps
  • Yields Hypotheses
  • SiGe Wafer Cost and Die Cost
  • RCP Wafer Cost
  • Components Cost

Estimated Sales Price

  • Manufacturer Financial Ratios
  • MR2001RVK, MR2001TVK, and MR2001VVK Estimated Sales Price

Radar Chipset Comparison with Infineon RASIC eWLB

  • Rx/Tx/VCO Comparison
  • Package Comparison (eWLB/RCP)
  • Cross-Section Comparison
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