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Physical Analysis and Cost Comparison of 28 CMOS Image Sensors Found in Seven Leading Flagship Smartphone Cameras from Apple, Samsung, Huawei, Xiaomi, Oppo and Vivo.

CMOS Image Sensors for leading flagships sold in 2018, Yole Developpement and SystemPlus Consulting offer two connected reports. , this overview will give you a comprehensive technical and cost evaluation of the main OEM choices.

System Plus Consulting has conducted a comprehensive technical and cost evaluation of CMOS Image Sensors in leading flagships sold in 2018. Discover the comparative study to provide insights into the structure and technology of 28 CIS die in seven flagship smartphones from several major brands: the Apple iPhone X; Samsung Galaxy S9 Plus; Huawei P20 Pro; Huawei Mate 20 Pro; Xiaomi Mi8 Explorer Version; Oppo Find X; and Vivo X21UD. This report is connected to the SystemPlus Consulting’s “Mobile Camera Module Comparison 2019” report, which gives an overview and details about the structure of each camera module.

The report has shown that the four manufacturers of CIS presented in the flagships, Sony, Samsung, Omnivision and STMicroelectronics, have totally different approaches. For example, Sony is the only manufacturer using hybrid bonding in the analyzed devices, having completely dropped fusion bonding with Through-Silicon Vias (TSVs). We have extracted further technical choices from the four players from the analysis and comparisons.

We analyze the CIS dies integrated in rear and front-facing CMOS Camera Modules (CCMs) including main cameras, wide angle, telephoto and near global shutter infrared, from technology node to die size. Additionally, we have studied the costs of the CISs to compare the economic choices of the manufacturers.

 

Overview/Introduction

• Executive Summary
• Reverse Costing Methodology

Company Profile

• Smartphones level
  • 6 OEMs
  • Teardown smartphones
• CIS Level
  • 3 visible CIS manufacturers
  • 3 infrared CIS manufacturers

Physical Comparison

• CIS Summary
• Rear-Facing
  • Dual camera
  • Triple camera
• Front-Facing
  • Standard camera
  • Dual camera (NIR CM)

Physical Evolution

• OEM Evolution
  • Apple
  • Samsung
  • Huawei
  • Xiaomi
• CIS Manufacturer Evolution

Manufacturing Process 

Visible

• Sony
• Samsung
• Omnivision

Infrared

• Omnivision
• STMicroelectronics
• Samsung

Cost Comparison

Visible

• Sony CIS Die
• Samsung CIS Die
• Omnivision CIS Die

Infrared

• Omnivision CIS Die
• STMicroelectronics CIS
• Samsung CIS Die

Cost per Smartphones

Detailed Physical Analysis

• Summary of the Physical Analysis
• CM Opening, CIS Overview & Cross-Section
  • iPhone X
  • Samsung Galaxy S9+
  • Oppo Find X
  • Xiaomi Mi8
  • Vivo X21 UD
  • Huawei P20 Pro
  • Huawei Mate 20 Pro

• Mobile Camera Module Comparison 2019
• Status of the Camera Module Industry 2019 – Focus on Wafer Level Optics
• RF Front-End Module Comparison 2018
• Thermal Management in Smartphones: Technology Comparison 2017
• Camera Module Industry 2015 – Mobile CCM Technology Review
• Apple vs. Samsung: Ambient Light and Proximity Sensing Devices Comparison
• Camera Module 2017 – Physical Analyses Overview
• ams’ Direct Time-of-Flight Detection SPAD-Based Proximity Sensor
• Sony’s 3D Time-of-Flight Depth Sensing Camera Module
• Mantis Vision’s 3D Depth Sensing System in the Xiaomi Mi8 Explorer Edition