IMAGING Infrared

Melexis Time of Flight Imager for Automotive Applications
- Published
- 04/07/2017
- Product code
- SP17336
- Price
- EUR 3 490
- Applications
- Automotive
Today, Time-of-Flight (ToF) systems are among the most innovative technologies offering imaging companies an opportunity to lead the market. Every major player wants to integrate these devices to provide functions such as 3D imaging, proximity sensing, ambient light sensing and gesture recognition. Sony/Softkinetic has been investigating this technology deeply, providing a unique pixel technology to several image sensor manufacturers in three application areas: consumer, automotive and industrial. For automotive applications, Sony/Softkinetic has licensed its technology to Melexis, which has worked on the pixel design to provide a ToF imager for gesture recognition.
The MLX75023 is an automotive 3D ToF Imager already integrated into gesture recognition systems from car makers like BMW. The 3D ToF Imager is packaged using Glass Ball Grid Array technology. The device comprises the die sensor and the glass filter in the same component in thin, 0.7 mm-thick, packaging.
This report analyzes the complete component, from the glass near-infrared band pass filter to the collector, based on the ToF pixel technology licenses developed by Softkinetic and improved by Melexis. The report includes a complete cost analysis and price estimation of the device based on a detailed description of the package, and the ToF imager.
It also features a complete ToF pixel technology comparison with Infineon, STMicroelectronics and Texas Instrument ToF imagers, which are also based on Sony/Softkinetic technology, with details on the companies’ choices.
Back to topOverview / Introduction
Melexis Company Profile and Time of Flight Technology
Physical Analysis
- Physical analysis methodology
- Package
- View and dimensions
- Package opening
- Package cross-section: optical filter, RDL, bump
- Image Sensor Die
- View, dimensions and marking
- Die overview: active area, CPAD technology
- Die delayering, main block ID and process
- Cross-section: metal layers, pixel
- Process characteristics
Physical Comparison with Infineon’s ToF Image Sensor, STMicroelectronics’ SPAD technology and Texas Instruments’ Industrial ToF Image Sensor
- Package, Pixels, Filters
Manufacturing Process Flow
- Overview
- CIS Front-End Process
- CIS Wafer Fabrication Unit
- Packaging Process Flow
- Final Assembly Unit
Cost Analysis
- Cost Analysis Overview
- The Main Steps Used in the Economic Analysis
- Yield Hypotheses
- CIS Die Cost
- Front-end cost
- Back-end: tests and dicing
- Wafer and die cost
- Component
- Packaging cost
- Packaging cost by process step
- Component cost
Estimated Price Analysis
Back to top
- Melexis Far Infrared Thermal Sensor MLX90640
- Guide Infrared’s 17µm Microbolometer Module
- IRay Technology 12µm and 17µm Thermal Sensors
- Hamamatsu Photodiode and Laser in Livox’s Horizon LiDAR
- VCSELs – Technology, Industry and Market Trends 2018
- Valeo SCALA Laser Scanner
- Heimann Sensor 32 x 32-array thermopile LWIR image sensor with silicon lens
- FLIR Boson – a small, innovative, low power, smart thermal camera core
- Autoliv’s 3rd Generation Automotive Night Vision Camera with FLIR’s ISC0901 Microbolometer
- InnoLight’s 400G QSFP-DD Optical Transceiver