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MEMS Pressure sensor

Melexis MLX91802 An absolute pressure sensor used in car and truck tire pressure monitoring system for harsh environments - System Plus Consulting

Melexis MLX91802

Published
27/09/2016
Product code
SP16279
Price
EUR 2 990
Applications
Automotive
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The Melexis MLX91802 is an absolute pressure sensor used in industrial and automotive applications for harsh environments (-40°C to 150°C), particularly in tire pressure monitoring systems (TPMS) for cars and trucks, with a pressure range of up to 1,400 KPa. The Melexis ASIC die integrates an LF transmitter at 125 KHz to facilitate the integration of the MLX91802 in a TPMS.

It is easy to use with either the factory calibration, Melexis’ firmware, or custom firmware, and is compatible with other integrated functions like the temperature sensor and battery monitoring.

This Melexis-designed MEMS pressure sensor is based on very reliable technology, with a thick membrane and a sealed cavity. Melexis’ smart packaging approach makes it easy to integrate into a system, and it is inexpensive. The absolute pressure measurement uses a soft coating rather than complex packaging with manifolds.

This report presents a detailed analysis of sensor structure and cost, as well as a characteristics comparison between Infineon’s SP37, Freescale’s FXTH87, and  Melexis’ MLX91802, highlighting the different technical choices made by each company.

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Overview/Introduction

Company Profile

  • Melexis
  • X-Fab
  • MLX91802 Characteristics

Physical Analysis

  • Physical Analysis Methodology
  • Package
    • Package views, dimensions, and pin out
    • Package opening & wire bonding process
    • Package cross-section
  •  ASIC
    • View, dimensions & marking
    • Delayering
    • Main blocks’ identification
    • Process identification
    • Cross-section
    • Process characteristics
  • MEMS Pressure Sensor
    • View, dimensions, and marking
    • Sensing area details
    • Cross-section
    • Piezoresistors
    • Process characteristics

Physical Comparison with Infineon’s SP37 and Freescale’s FXTH87

Sensor Manufacturing Process

  • Global Overview
  • ASIC Front-end Process
  • ASIC Wafer Fabrication Unit
  • MEMS Pressure Sensor Process Flow
  • MEMS Wafer Fabrication Unit
  • Packaging Process Flow & Assembly Unit

Cost Analysis

  • Synthesis of the Cost Analysis
  • Main Steps of the Economic Analysis
  • Yields Explanation & Hypotheses
  • ASIC Die
    • ASIC front-end cost
    • ASIC probe test & dicing cost
    • ASIC wafer & die cost
  • MEMS Pressure Sensor Die
    • MEMS pressure sensor front-end cost
    • MEMS pressure sensor cost per process steps
    • MEMS pressure sensor probe test & dicing cost
    • MEMS pressure sensor wafer & die cost
  • Back-end: Final Test & Calibration Cost
  • MLX91802 Component Cost

Estimated Sales Price

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