MEMS Accelerometer

mCube MC3635

Published: 05/04/2016
Product code: SP16256
Price: EUR 3 290
Applications: Consumer

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Introduction
Summary
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With its market share increasing every year, mCube is seeking to become a leader in the MEMS accelerometer business using its monolithic single-chip MEMS design approach. With the MC3635, mCube has released the industry’s smallest ultra-low power accelerometer for wearables, enabling significantly extended battery life and very small form factors.

Unlike its main competitors, Bosch Sensortec and STMicroelectronics, mCube provides monolithic sensor integration for consumer electronics – the only company to do this for accelerometers.

mCube’s approach fabricates MEMS sensors directly on top of IC electronics, connected using Through-Silicon Vias (TSVs), in a standard CMOS fabrication facility. The MC3635 is shipped in 1.6×1.6mm LGA packaging, which is a 36% footprint reduction compared to traditional 2x2mm LGA packages. Among the third generation of mCube accelerometers, the MC3635’s package is smaller than the MC3400 series, but the die size is slightly larger due to the ultra-low power capability.

The MC3635 is targeted at the ultra-low power and the high-resolution marketplace for applications requiring up to 14-bit resolution.
The report includes a complete overview of mCube’s MEMS accelerometer evolution since its second generation. It also features a detailed technology and cost comparison with leading edge accelerometers from Bosch Sensortec, STMicroelectronics and Analog Devices.

Overview / Introduction

mCube Company Profile

Physical Analysis

Physical Analysis Methodology
Package
Package Characteristics Marking & Pin-out
Package Opening & Wire Bonding Process
Package Cross-Section
Die
Dimensions & Markings
Bond Pad Opening
MEMS Cap Removed
MEMS Cap Details
MEMS Sensing Area
MEMS Sensing Area Removed
Delayering (Metal Layers Removed)
IC Process
Die Cross-Section

mCube MEMS Accelerometer Evolution

Technology comparison with Bosch Sensortec and STMicroelectronics 3-Axis Accelerometers

Technology comparison with Analog Devices Ultra-Low Power 3-Axis Accelerometers

Manufacturing Process Flow

Global Overview
IC Front-End Process
MEMS Process Flow
Wafer Fabrication Unit
Packaging Process Flow & Assembly Unit

Cost Analysis

Main steps of economic analysis
Yield Hypotheses
CMOS Front-End Cost
MEMS Front-End Cost
MEMS Front-End Cost per process steps
Total Front-end Cost
Back-End 0: Probe Test & Dicing
Wafer & Die Cost
Back-End: Packaging Cost
Back-End: Packaging Cost per Process Steps
Back-End: Final Test Cost
MC3635 Component Cost & Price

Cost & Price comparison with Bosch Sensortec and STMicroelectronics 3-Axis Accelerometers