Sensing

Maxim Integrated MAX21000 – 3-Axis MEMS Gyroscope

Published: 03/06/2014
Product code: SP14173
Price: EUR 6990
Applications: Mobile & Consumer

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Introduction
Summary
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Following the purchase of MEMS manufacturer SensorDynamics in 2011, Maxim releases its first MEMS Gyroscope reference with a very accurate and cost effective component.

The MAX21000 continues to use the PSM-X2 process jointly developed by SensorDynamics and the Fraunhofer Institute for Silicon Technology. This technology platform includes a proprietary surface micromachining process to build the mechanical structures and a gold silicon eutectic wafer bonding allowing an hermetic encapsulation of the gyro sensor.

Compared with state of the art 3x3mm MEMS gyroscopes supplied by STMicroelectronics and Bosch Sensortec, the new design developed by Maxim for this reference offers 28% to 35% reduction in silicon area for the MEMS die, enabling a significant cost advantage.

Assembled in a LGA 3.0×3.0x0.9mm package, the MAX21000 is a low power consumption (5.4mA) and high accuracy 3-axis gyroscope targeted for mobile applications.

Glossary

Overview/Introduction , Maxim Company Profile

Physical Analysis

Package

Package Views & Dimensions

Package Pin Out

Package Opening

Wire Bonding Process

Package Cross-Section

ASIC Die

View, Dimensions & Marking

Delayering

Main Blocks Identification

Cross-Section

Process Characteristics

MEMS Die

View, Dimensions & Marking

Bond Pad Opening

Cap Removed & Cap Details

Sensing Area Details

Cross-Section (Sensor, Cap & Sealing)

Process Characteristics

Manufacturing Process Flow

Global Overview
ASIC Front-End Process
ASIC Wafer Fabrication Unit
MEMS Process Flow
MEMS Wafer Fabrication Unit
Packaging Process Flow
Package Assembly Unit

Cost Analysis

Main steps of economic analysis
Yields Hypotheses
ASIC Front-End Cost
ASIC Back-End 0 : Probe Test & Dicing
ASIC Wafer & Die Cost
MEMS Front-End Cost
MEMS Back-End 0 : Probe Test & Dicing
MEMS Front-End Cost per process steps
MEMS Wafer & Die Cost
Back-End : Packaging Cost
Back-End : Packaging Cost per Process Steps
Back-End : Final Test Cost
MAX21000 Component Cost

Estimated Price Analysis