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Sensing

Maxim Integrated MAX21000 – 3-Axis MEMS Gyroscope

Published
03/06/2014
Product code
SP14173
Price
EUR 6990
Applications
Mobile & Consumer
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Following the purchase of MEMS manufacturer SensorDynamics in 2011, Maxim releases its first MEMS Gyroscope reference with a very accurate and cost effective component.

The MAX21000 continues to use the PSM-X2 process jointly developed by SensorDynamics and the Fraunhofer Institute for Silicon Technology. This technology platform includes a proprietary surface micromachining process to build the mechanical structures and a gold silicon eutectic wafer bonding allowing an hermetic encapsulation of the gyro sensor.

Compared with state of the art 3x3mm MEMS gyroscopes supplied by STMicroelectronics and Bosch Sensortec, the new design developed by Maxim for this reference offers 28% to 35% reduction in silicon area for the MEMS die, enabling a significant cost advantage.

Assembled in a LGA 3.0×3.0x0.9mm package, the MAX21000 is a low power consumption (5.4mA) and high accuracy 3-axis gyroscope targeted for mobile applications.

 

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Glossary

Overview/Introduction , Maxim Company Profile

 Physical Analysis

  • Package
  • Package Views & Dimensions
  • Package Pin Out
  • Package Opening
  • Wire Bonding Process
  • Package Cross-Section
  • ASIC Die
  • View, Dimensions & Marking
  • Delayering
  • Main Blocks Identification
  • Cross-Section
  • Process Characteristics
  • MEMS Die
  • View, Dimensions & Marking
  • Bond Pad Opening
  • Cap Removed & Cap Details
  • Sensing Area Details
  • Cross-Section (Sensor, Cap & Sealing)
  • Process Characteristics

Manufacturing Process Flow

  • Global Overview
  • ASIC Front-End Process
  • ASIC Wafer Fabrication Unit
  • MEMS Process Flow
  • MEMS Wafer Fabrication Unit
  • Packaging Process Flow
  • Package Assembly Unit

 Cost Analysis

  • Main steps of economic analysis
  • Yields Hypotheses
  • ASIC Front-End Cost
  • ASIC Back-End 0 : Probe Test & Dicing
  • ASIC Wafer & Die Cost
  • MEMS Front-End Cost
  • MEMS Back-End 0 : Probe Test & Dicing
  • MEMS Front-End Cost per process steps
  • MEMS Wafer & Die Cost
  • Back-End : Packaging Cost
  • Back-End : Packaging Cost per Process Steps
  • Back-End : Final Test Cost
  • MAX21000 Component Cost

Estimated Price Analysis

 

 

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