Compound Semiconductors And Emerging Substrates

Littelfuse Silicon Carbide MOSFET LSIC1MO120E0080: 1200V 25A 80mOhms
- Published
- 11/04/2018
- Product code
- SP18390
- Price
- EUR 6990
- Applications
- Automotive & Mobility Industrial Mobile & Consumer
Littelfuse and Monolith Semiconductors, in collaboration with X-Fab, have released a 1st-generation, high-reliability MOSFET with the hope of making this silicon carbide product mainstream.
The market outlook for SiC devices is promising, with a compound annual growth rate (CAGR) of 28% from 2016 – 2020. This will increase to 40% from 2020 – 2022 due to growth among automotive and industrial applications. In total, the SiC market will exceed $1B in 2022. In the energy conversion sector, SiC devices have an actual value of $250M, which will increase by around 28% in 2022. The reason for this relates to market forces pushing for loss reduction, not only for the sake of improved efficiency but also for smaller packages.
Littelfuse, Inc., a leader in circuit protection, recently introduced its first series of silicon carbide (SiC) MOSFETs. This is the latest addition to the company’s power semiconductor line, realized through a majority investment in Monolith Semiconductor Inc., a SiC technology development company.
The LSIC1MO120E0080, with a voltage rating of 1200V and ultra-low (80mΩ) on-resistance, is the first organically designed, developed, and manufactured SiC MOSFET to be released by this partnership, using all of X-Fab’s know-how and experience, along with its 150mm SiC production line in Lubbock.
Supported by a full component and package teardown, this report reveals Littelfuse’s innovative assets, which bring several advantages to the 1200V SiC MOSFET: most notably, superior gate-oxide reliability, switching performance, and conduction losses.
This report also details the complete bill of materials (BoM), die manufacturing, and packaging processes. Included too are an estimated manufacturing cost, a comparison with similar products from STMicroelectronics and CREE, and an estimated sales price of the Littelfuse component.
Back to topOverview/Introduction
- Executive Summary
- Reverse Costing Methodology
Company Profile
- Littelfuse Semiconductor
Physical Analysis
- Synthesis of the Physical Analysi
- Package Analysis
- Package opening
- Package cross-section
- MOSFET Die
- MOSFET die – view and dimensions
- MOSFET – die process
- MOSFET – die cross-section
- MOSFET – die process characteristics
MOSFET Manufacturing Process
- MOSFET Die – Front-End Process
- MOSFET Die – Fabrication Unit
- Final Test and Packaging – Fabrication Unit
Cost Analysis
- Synthesis of the Cost Analysis
- Yields Explanation and Hypotheses
- MOSFET Die
- MOSFET – front-end cost
- MOSFET – die probe test, thinning and dicing
- MOSFET – wafer cost
- MOSFET – die cost
- Complete MOSFET
- Assembled components cost
- Synthesis of the assembly
- Component cost
Price Analysis
- Estimated Sales Price
Comparison
- 1200V CREE and STMicroelectronic SiC MOSFET Comparison
- SiC vs IGBT Comparison
- Discrete Power Device Packaging Comparison 2021
- BCD Technology and Cost Comparison 2021
- GaN Systems GS61004B GaN HEMT
- EPC2045 100V GaN-on-Silicon Transistor
- SiC Transistor Comparison 2021
- EPC2152 Half Bridge Monolithic GaN IC
- Silicon IGBT Comparison 2021
- STMicroelectronics MASTERGAN1 Half-Bridge Driver
- SiC Transistor Comparison 2020
- GaN Power Transistor Comparison 2020