Photonics

LeddarVu8: The first off-the-shelf solid state high-definition LiDAR module from LeddarTech

Published: 11/04/2017
Product code: SP17320
Price: EUR 3 990
Applications: Automotive & Mobility Industrial

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Introduction
Summary
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The light detection and ranging principle and technology, also known as LiDAR, is used in a wide spectrum of applications. With upcoming autonomous or “self-driving” cars, LiDAR technology is being considered for one option for the “eyes” of such vehicles. However, existing systems do not match the challenging reliability, compactness and cost-efficiency specifications of the automotive world.

Based on “LeddarCore” components, Leddartech has developed LeddarVu8, a compact solid-state LiDAR without mechanical movement that provides highly accurate multi-target detection over eight independent segments. It detects targets at up to 215 m range despite its tiny size of 70 mm x 35 mm x 46 mm and weighing only 75 grams. The LeddarVu8 delivers nearly twice the range for half the volume compared to the previous version.

These qualities qualify the LeddarVu8 as a candidate for advanced driver assistance, replacing the radar. With its adjustable and interchangeable optics module, the LeddarVu8 can also be interesting for other applications, such as traffic management, speed enforcement, heavy-duty equipment collision warning, navigation, liquid level sensing and bulk volume measurements.

The light is emitted by Excelitas’ tri-stacked emitting edge laser diode of 75W and received by a photodiode array. The two components are designed for large volume markets and some innovations reduce their usually high cost. This first automotive version of the LeddarVu8 shows the full potential of this technology to go under the $100 barrier.

This report presents the full system manufacturing and packaging processes for the LeddarVu8 as well as the physical analysis of the two main optical components, the laser diode and the photodiode. An estimation of the manufacturing cost and selling price is included.

GLOBAL SYSTEM REPORT

Overview / Introduction

Company Profile

System Physical Analysis

Views and Dimensions
System Opening and Overview
Main Electronic Board
Receiver Board
Emitter Board

Cost Analysis

Accessing the BOM
PCB Cost
BOM Cost – Mother Electronic
Board
Housing Parts – Estimation
BOM Cost – System Housing
Material Cost Breakdown by Component Category
Accessing the Added Value (AV) cost
Mother Board Manufacturing Flow
Details of the Mother Electronic Board AV Cost
Details of the Module Assembly AV Cost
Added-Value Cost Breakdown
Manufacturing Cost Breakdown

Selling Price

Estimation of the Manufacturing and Selling Price

LASER DIODE AND PHOTODIODE REPORTS

Overview / Introduction

Company Profile

Physical Analysis

Synthesis of the Physical Analysis
Package Analysis
- Package opening
- Package cross-section
Die
- View and dimensions
- Die cross-section
- Die process characteristic

Manufacturing Process Flow

Die Front-End Process
Die Fabrication Unit
Package Process Flow
Final Test and Packaging Fabrication unit

Cost Analysis

Yield Hypotheses
Die Cost
- Front-end cost
- Probe tests and dicing
- Wafer and die cost
- Wafer cost evolution
- Packaging cost and step cost
- Component cost and evolution

Estimated Price Analysis