Sensing

iPhone 5S MEMS Microphones Knowles

Published: 20/02/2014
Product code: SP14159
Price: EUR 6990
Applications: Mobile & Consumer

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Introduction
Summary
Similar reports

In this version of Apple iPhone, Knowles succeeds in integrating two MEMS microphones out of the three present in the phone. The third microphone is from AAC Technologies which was also already present in the previous iPhone 5.

Apple thus uses the same MEMS microphones suppliers for the iPhone 5S, but each of them modified the design and the manufacturing process of their components to improve them by making them more robust.

Compared to the microphone used in the iPhone 5, Knowles major changes include the number of transducers of the MEMS die (impacting directly the die size) and the thickness of the backplate.

On its side, AAC Technologies also modified the design of the MEMS die (still supplied by Infineon) and the thickness of key layers.

Discover in this set of two reports the latest evolutions from the first two MEMS microphone leaders.

COMPLETE TEARDOWN WITH:

Detailed Photos

Precise Measurements

Material Analysis

Manufacturing Process Flow

Supply Chain Evaluation

Manufacturing Cost Analysis

Selling Price Estimation

Glossary

Overview/Introduction

Companies Profile

iPhone 5S Teardown

Physical Analysis

Physical Analysis Methodology
Package

Package Views & Dimensions

Package Opening

Package Cross-Section

ASIC Die

View, Dimensions & Marking

Delayering, Process Identification

Cross-Section

Process Characteristics

MEMS Die

View, Dimensions & Marking

Dicing

Bond Pads

Diaphragm & Backplate

Cavities

Anti-stiction features

Cross-Section

Manufacturing Process Flow

Global Overview
ASIC Front-End Process
ASIC Wafer Fabrication Unit
MEMS Process Flow
MEMS Wafer Fabrication Unit
Packaging Process Flow
Package Assembly Unit

Cost Analysis

Main steps of economic analysis
Yields Hypotheses
ASIC Front-End Cost
ASIC Back-End 0 : Probe Test & Dicing
ASIC Wafer Cost

ASIC Die Cost
MEMS Front-End Cost
MEMS Back-End 0 : Probe Test & Dicing
MEMS Front-End Cost per process steps
MEMS Front-End: Equipment Cost per Family
MEMS Front-End: Material Cost per Family
MEMS Wafer Cost
MEMS Die Cost
Back-End : Packaging Cost
Back-End : Packaging Cost per Process Steps
Back-End : Final Test Cost
Microphone Component Cost & Price