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MEMS IMU/Combo

Invensense MPU-6000/6050 Motion Processing Unit : 3D accelerometer + 3D gyroscope

Published
26/10/2011
Product code
SP11072
Price
EUR 1 990
Applications
Consumer
Available sample Available flyer Ask for info

System Plus Consulting is proud to publish the reverse costing report on the MPU-6000/6050 MEMS from InvenSense.

The MPU-6000/6050 is the first inertial MEMS that combines a 3D accelerometer and a 3D gyroscope in the same silicon substrate together with a signal conditioning circuitry in a 4x4x0.9mm³ QFN package.

The MPU-6000/6050 is targeted for mobile phones, gaming devices, Portable Navigation Devices and remote controllers.

This report provides complete teardown of the inertial MEMS with:

  • Detailed photos
  • Material analysis
  • Schematic assembly description
  • Manufacturing Process Flow
  • In-depth economical analysis
  • Manufacturing cost breakdown
  • Selling price estimation

 

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1. Introduction

  • Executive Summary
  • Reverse Costing Methodology

2. Company Profiles

 3. Physical Analysis

  • Physical Analysis Methodology
  • Package Characteristics & Markings
  • Package X-Ray
  • Package Opening
  • Package Cross-Section
  • Device Structure
  • Die Dimensions
  • MEMS Sensor
  • MEMS Sensor -3-Axis Gyroscope
  • MEMS Sensor -3-Axis Accelerometer
  • ASIC Marking
  • ASIC Bond Pad
  • ASIC Cavities
  • Component Cross-Section
  • Physical Data Summary

4. Manufacturing Process Flow

  • Global Overview
  • ASIC Process Flow
  • MEMS Process Flow
  • Description of the Wafer Fabrication Units

5. Cost Analysis

  • Synthesis of the Cost Analysis
  • Yields Explanation
  • ASIC Front-End Cost ( CMOS+ Cavities)
  • MEMS Front-End Cost
  • MEMS Wafer : Equipment Cost per Family
  • MEMS Wafer : Consumable Cost per Family
  • Total Wafer Cost
  • MEMS Die cost
  • Component Packaging Cost
  • Component Final Test Cost

6. Estimated Price Analysis

  • Manufacturers financial ratios
  • Estimated manufacturer Price
  • Estimated Selling Price

 

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