MEMS IMU/Combo

With 74.5 million units of iPhone sold during the last quarter 2014, InvenSense made a very good deal by replacing STMicroelectronics as the supplier of the gyroscope for the iPhone 6 and 6 Plus.

The MP67B is a custom version of InvenSense 6-Axis device (3-Axis gyroscope + 3-Axis accelerometer) made for Apple. Compared to InvenSense’s standard 6-Axis device MPU-6500, specific modifications have been realized. The main ones consist in the package modification with the use of a LGA substrate compared to a QFN leadframe, and in the ASIC which has been redesigned.

The MP67B uses the same process as InvenSense’s second generation 6-axis device with a new design of the 3-axis gyroscope which now uses a single structure vibratory compared to three different structures for the previous generation of gyros. This new design results in a shrink of 40% of the 3-axis gyro area. The second benefit of this new design is that Nasiri process has been changed: cavities which were traditionally etched in the ASIC to allow MEMS structures moving are no longer used, thus resulting in cost reduction.

Glossary

Overview/Introduction , InvenSense Company Profile

Physical Analysis

• Package
  • Package Views & Dimensions
  • Package Opening
  • Wire bonding Proces
  • Package Cross-Section
• Die
  • View, Dimensions & Marking
  • MEMS Removed
  • MEMS Sensing Area
  • MEMS Cap
  • ASIC Delayering & Process
  • Die Cross-Section: ASIC
  • Die Cross-Section: Sensor
  • Die Cross-Section: Sealing
  • Die Cross-Section: Cap

Comparison with InvenSense MPU-6500

Manufacturing Process Flow

• ASIC Front-End Process
• MEMS Process Flow
• Wafer Fabrication Unit
• Packaging Process Flow & Assembly Unit

Cost Analysis

• Yields Hypotheses
• ASIC Front-End Cost
• MEMS Front-End Cost
• MEMS Front-End Cost per process steps
• Total Front-end Cost
• Back-End : Probe Test & Dicing
• Wafer & Die Cost
• Back-End : Packaging Cost
• Back-End : Packaging Cost per Process Steps
• Back-End : Final Test & Calibration Cost
• Component Cost

Estimated Price Analysis

• InvenSense Financial Ratios
• Component Price

• MEMS Packaging: Reverse Technology Review
• InvenSense ICM-20789: High Performance 6-Axis Motion Sensor and Pressure Sensor Combo
• 6-Axis OIS IMUs
• InvenSense ICM-30630
• InvenSense MPU-9250 9-Axis IMU
• InvenSense MPU-6500 6-Axis MEMS IMU
• Invensense – MPU-9150
• Invensense MPU-6000/6050 Motion Processing Unit : 3D accelerometer + 3D gyroscope
• Status of the MEMS Industry 2018
• MEMS Pressure Sensor Comparison 2018