Sensing

InvenSense MP67B
- Published
- 05/02/2015
- Product code
- SP15204
- Price
- EUR 6990
- Applications
- Mobile & Consumer
With 74.5 million units of iPhone sold during the last quarter 2014, InvenSense made a very good deal by replacing STMicroelectronics as the supplier of the gyroscope for the iPhone 6 and 6 Plus.
The MP67B is a custom version of InvenSense 6-Axis device (3-Axis gyroscope + 3-Axis accelerometer) made for Apple. Compared to InvenSense’s standard 6-Axis device MPU-6500, specific modifications have been realized. The main ones consist in the package modification with the use of a LGA substrate compared to a QFN leadframe, and in the ASIC which has been redesigned.
The MP67B uses the same process as InvenSense’s second generation 6-axis device with a new design of the 3-axis gyroscope which now uses a single structure vibratory compared to three different structures for the previous generation of gyros. This new design results in a shrink of 40% of the 3-axis gyro area. The second benefit of this new design is that Nasiri process has been changed: cavities which were traditionally etched in the ASIC to allow MEMS structures moving are no longer used, thus resulting in cost reduction.
Back to topGlossary
Overview/Introduction , InvenSense Company Profile
Physical Analysis
- Package
- Package Views & Dimensions
- Package Opening
- Wire bonding Proces
- Package Cross-Section
- Die
- View, Dimensions & Marking
- MEMS Removed
- MEMS Sensing Area
- MEMS Cap
- ASIC Delayering & Process
- Die Cross-Section: ASIC
- Die Cross-Section: Sensor
- Die Cross-Section: Sealing
- Die Cross-Section: Cap
Comparison with InvenSense MPU-6500
Manufacturing Process Flow
- ASIC Front-End Process
- MEMS Process Flow
- Wafer Fabrication Unit
- Packaging Process Flow & Assembly Unit
Cost Analysis
- Yields Hypotheses
- ASIC Front-End Cost
- MEMS Front-End Cost
- MEMS Front-End Cost per process steps
- Total Front-end Cost
- Back-End : Probe Test & Dicing
- Wafer & Die Cost
- Back-End : Packaging Cost
- Back-End : Packaging Cost per Process Steps
- Back-End : Final Test & Calibration Cost
- Component Cost
Estimated Price Analysis
- InvenSense Financial Ratios
- Component Price
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