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MEMS Gyroscope

InvenSense IDG-600/650 2-Axis Gyroscope

Product code
EUR 1 990
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System Plus Consulting is proud to publish the reverse costing report of the Dual-Axis MEMS Gyroscope IDG-600/650 supplied by InvenSense.

The IDG-600, integrated in the Nintendo Wii Motion Plus accessory, and its standard variation the IDG-650 share the same hardware. The components are manufactured using a three-bonded-wafer process: a thin sensor wafer and a protective cap wafer processed with bulk micromachinning and an ASIC wafer for signal conditioning.

The IDG-600/650 gyroscopes are suitable for high performance motion sensing game controllers, pointing devices, multimedia remotes and computer mice applications.

This report provides complete teardown of the MEMS Gyroscope with:

  • Detailed photos
  • Material analysis
  • Schematic assembly description
  • Manufacturing Process Flow
  • In-depth economical analysis
  • Manufacturing cost breakdown
  • Selling price estimation



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  • Executive Summary
  • Reverse Costing Methodology

 InvenSense Company Profile

  • Product Range
  • Business Model

 Physical analysis

  • Synthesis of the Physical Analysis
  • Physical Analysis Methodology
  • Package Characteristics & Markings
  • Package Opening & Bonding Number
  • IDG-600 / IDG-650 Comparison
  • Device Structure
  • Device Dimensions
  • ASIC Markings
  • ASIC Minimal Dimension and Metal Layers
  • ASIC Main Blocks
  • ASIC Process Characteristics
  • MEMS Markings
  • MEMS Sensor IR View
  • MEMS Sensor Details
  • Component Cross-Section
  • MEMS process characteristics

Manufacturing Process Flow

  • Overview
  • ASIC Process Flow (CMOS + Cavity Etch)
  • MEMS Process Flow (Cap + Sensor + Assembly)

 Cost Analysis

  • Synthesis of the Cost Analysis
  • Main Steps of Economic Analysis
  • Supply Chain Analysis
  • Manufacturers financial ratios
  • Yields Explanation
  • ASIC Front-End Cost
  • MEMS Front-End Cost
  • MEMS Front-End Cost per Process Steps
  • MEMS Front-End : Equipment Cost per Family
  • MEMS Front-End : Material Cost per Family
  • Total Front-End Cost (ASIC + MEMS + Assembly)
  • Back-End 0 : Probe Test and Dicing
  • Total Wafer Cost (Front-End + Back-End 0)
  • Die cost
  • Packaging Cost
  • Final Test Cost
  • Component Manufacturing Cost
  • Yield Synthesis

 Estimated Manufacturer Price Analysis





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