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InvenSense ICM20789: High Performance 6-Axis Motion Sensor & Pressure Sensor Combo first ‘7-Axis’ motion tracking device targeting drone applications

InvenSense ICM-20789: High Performance 6-Axis Motion Sensor and Pressure Sensor Combo

Product code
EUR 3 490
Available sample Available flyer Ask for info

Having supplied Apple for many years, InvenSense (TDK) is a leader in the inertial measurement unit (IMU) market. It has a large market share, competing with Bosch and others. This year, with the acquisition of Sensirion’s barometric pressure sensor division, InvenSense has entered a new market area. It has now released of its first ‘7-axis’ motion tracking combo, bringing together a 6-axis IMU and a pressure sensor, moving it into drone applications.

The ICM-20789 7-axis combo sensor released by InvenSense features a 6-axis device, incorporating a 3-axis gyroscope and a 3-axis accelerometer, and a barometric pressure sensor previously developed by Sensirion in the same package. Compared with the stand-alone sensor hub, this approach eliminates a package and minimizes board area requirements.

The pressure sensor’s MEMS capacitive architecture provides the industry’s lowest noise at the lowest power. Combined with the motion-tracking 6-axis inertial sensor in a small footprint, the device is ideal for a wide range of motion tracking applications.

The inertial MEMS sensor is fabricated with a minimal number of masks and is directly assembled on the application-specific integrated circuit (ASIC) by eutectic bonding. Using knowledge obtained by acquiring Sensirion’s pressure sensor division, InvenSense was able to design its own pressure sensor. The device is shipped in a 4 mm x 4 mm x 1.37 mm land grid array (LGA) package.

This report includes a detailed technology and cost analysis of the ICM-20789 7-axis motion tracking device. A comparison with the previous generation of combo sensors from InvenSense is also included in the report.

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Overview / Introduction

Company Profile and Supply Chain

Physical Analysis

  • Package
    • Package views and dimensions, opening and cross-section
  • Pressure Sensor Die
    • View, dimensions, and marking
    • Delayering and process
    • Cross-section
  • MEMS Die
    • View, dimensions and marking
    • Cap removed
    • Sensing area
    • Cross-sections of the sensor, cap, and seal
  • ASIC Die
    • View, dimensions, and marking
    • Delayering and process
    • Cross-section

Manufacturing Process Flow

  • ASIC front-end process and wafer fabrication unit
  • Pressure sensor process flow and wafer fabrication unit
  • MEMS process flow and wafer fabrication unit
  • Packaging process flow and assembly unit

Cost Analysis

  • Yield hypotheses
  • Pressure sensor front-end cost
  • Pressure sensor back-end 0: probe test and dicing
  • Pressure sensor front-end cost per process steps
  • Pressure sensor wafer and die cost
  • ASIC front-end cost
  • ASIC back-end 0: probe test and dicing
  • ASIC wafer and die cost
  • MEMS front-end cost
  • MEMS back-end 0: probe test and dicing
  • MEMS front-end cost per process steps
  • MEMS wafer and die cost
  • Back-end: packaging cost
  • Back-end: packaging cost per process steps
  • Back-end: final test cost
  • IMU component cost

Estimated Price Analysis

Comparison with InvenSense IMU MP-67B, Sensor Hub ICM-30360 and iPhone 7 Plus OIS IMU

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