IMAGING

A high-resolution LiDAR sensor featuring a bi-axial MEMS mirror scanner associated with an infrared laser and a RGB camera.

The RealSense L515 is the third generation of 3D sensing camera from Intel and the first with a MEMS based solid-state LIDAR.

The 3D sensor has a minimum depth of 0.25m. It can scan environments up to 9m wide with a resolution depth of up to 1024×768 at 30 frames per second (fps). The system uses Application Specific Integrated Circuits (ASICs) from Intel for vision processing and MEMS control. This camera LIDAR with its machine vision processor is optimized for 3D scanning, smart building and robotic applications.

The RealSense L515 integrates an intelligent USB-C powered solid-state LIDAR camera in a compact aluminium case. It combines a conventional red/green/blue (RGB) color sensor, a near infrared LIDAR for 3D sensing. The LIDAR is based on an Edge-Emitting Laser (EEL) for the light source, a MEMS micro-mirror to scan the environment, a photodiode to measure the time of flight and optical lenses to focus the beam. The bi-axial micro-mirror from STMicroelectronics is the core of the scanning mechanism.

System Plus Consulting proposes two reports featuring a complete teardown analysis of the RealSense L515. One report provides high definition pictures of the electronics boards and the bill-of-material (BOM) and manufacturing cost of the LIDAR camera.

The second report includes detailed technical and cost analysis of the main devices. It presents detailed optical and Scanning Electron Microscope (SEM) images of the beam splitter, the micro-mirror, the EEL, the photodiode and the main ICs. It also details the complete manufacturing cost calculation and estimates selling price. Finally, it includes a comparison of the L515 with previous generation LIDAR from Intel.

Intel Company Profile

Module Physical Analysis

• Views and Dimensions of the Camera
• Camera Opening
• Vision Processor, 3D Sensing and RGB Sensor Boards

Detailed Physical Analysis

• Lens Module
  • Module views, disassembly and main block identification
  • Module cross-section
• Infrared EEL Laser Component
  • Package
  • EEL die view and dimensions
  • EEL die cross-section and process characteristics
• Magnetic Micro-Mirror
  • Micro-mirror dimensions
  • Micro-mirror cross section
• Photodiode
  • Photodiode overview and dimensions
  • Photodiode process and cross-section

Manufacturing Process Flow

• NIR EEL Laser Die Front-End Process and Fabrication Unit
• Micro-Mirror Process Flow and Fabrication Unit
• Photodiode Wafer Process Flow and Fabrication Unit
• Readout IC Driver Die Front-End Process and Fabrication Unit

Cost Analysis

• PCBs, Electronic Boards, Mechanical Parts and housing
• Component Yield Explanations and Hypotheses
  • NIR EEL laser
    • Wafer and die cost
  • Micro-mirror
    • Wafer and die cost
  • Photodiode die
    • Wafer and die cost
  • Readout circuit
  • Lens, optics and module

Estimation of the Selling Price

• Spectral Engines Nirone Sensor X
• Melexis Far Infrared Thermal Sensor MLX90640
• Hamamatsu C12880MA Micro-spectrometer
• Apple iPhone X Special Offer
• poLight TLens MEMS Autofocus
• Guide Infrared’s 17µm Microbolometer Module
• IRay Technology 12µm and 17µm Thermal Sensors
• Goodix’s Ultra-Thin Optical Under-Display Fingerprint
• Goodix Under-Display Optical Fingerprint
• Status of the Camera Module Industry 2019 – Focus on Wafer Level Optics