SYSTEM Consumer

Intel RealSense D435 3D Active IR Stereo Depth Camera

Published: 31/05/2018
Product code: SP18404
Price: EUR 3 490
Applications: Consumer

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Introduction
Summary
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The 3D camera is using infrared active stereo depth and red/green/blue sensors, and a VCSEL projector.

Integrated in a compact aluminum case, the Intel RealSense D435 is an intelligent USB-C powered 3D active infra-red global shutter stereo depth camera. It combines a conventional red/green/blue (RGB) color sensor, a vertical-cavity surface-emitting laser (VCSEL) projector and left- and right-side imagers for stereo vision.

The 3D camera has a minimum depth of 0.2m and can scan environments up to 10m wide with a resolution depth of up to 1280×720 at 90 frames per second (fps). The system uses a 28nm Intel D4 vision processor for processing complex depth data in real time and a Realtek color image processor.

The infrared laser projector is tiny, measuring only 2.7mm x 1.8mm, uses VCSEL technology and can record 60fps. Omnivision supplies the three image sensors; a CMOS 1080p RGB sensor and twin 1-megapixel sensors for the left and right side imagers.

The components and sensors are contained in ball grid array (BGA) and wafer level packaging, all mounted on two single-sided boards whose total surface area is less than 20cm².

Based on a complete teardown analysis of the RealSense D435, the report provides high definition pictures of the vision processor, VCSEL IR projector and image sensor dies as well as the bill-of-material (BOM) and the manufacturing cost of the depth module.

Intel Company Profile, Camera Main Features and Main Chipset

Physical Analysis

Camera Teardown
Electronic Boards
- Overview
- High definition photos
- Components markings and identification
Die Pictures
Sensors Board Cross Section
Lens Modules Cross Section

Cost Analysis

Accessing the BOM
PCBs Cross Sections and Cost Analysis
Omnivision OV9282 CIS Die Pictures and Cost Estimation
VCSEL Die Pictures, Cross Section and Cost Estimation
Estimation of the cost of the Lens Module
BOM Cost – MCU Board
BOM Cost – Sensors Board
BOM Cost – Housing
Material Cost Breakdown
Accessing the Added Value (AV) cost
MCU Board Manufacturing Flow and Added Value Cost
Sensors Board Manufacturing Flow and Added Value Cost
Details of the System Assembly AV Cost
Added-Value Cost Breakdown
Manufacturing Cost Breakdown

Estimation of the Selling Price – Intel